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MSP430F67751AIPZR

Texas Instruments

MSP430F67751AIPZR by Texas Instruments

MSP430F67751AIPZR by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.379

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 114,496 parts In-Stock

1+ parts

$6.379

100+ parts

$5.201

1k+ parts

$3.467

10k+ parts

-

114,496

$6.379

$5.201

$3.467

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,716 parts In-Stock

1+ parts

$6.060

100+ parts

-

1k+ parts

-

10k+ parts

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1,716

$6.060

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-

-

Vyrian

USA . 8,063 parts In-Stock

1+ parts

-

100+ parts

-

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-

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8,063

-

-

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Chip Stock

USA . 2,710 parts In-Stock

1+ parts

-

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-

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2,710

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LWI Electronics Inc

India . 14 parts In-Stock

1+ parts

-

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-

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14

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,679 parts In-Stock

1+ parts

$5.741

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

$5.741

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$17.139

100+ parts

$16.968

1k+ parts

$16.282

10k+ parts

-

3,000

$17.139

$16.968

$16.282

-

AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$19.090

100+ parts

-

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-

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216

$19.090

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-

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Microchip USA

USA . 1,845 parts In-Stock

1+ parts

$30.730

100+ parts

$30.540

1k+ parts

$30.440

10k+ parts

$30.350

1,845

$30.730

$30.540

$30.440

$30.350

Parana Technologies

USA . 1,862 parts In-Stock

1+ parts

$36.689

100+ parts

-

1k+ parts

-

10k+ parts

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1,862

$36.689

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-

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ChromeModa Solutions

Germany . 1,778 parts In-Stock

1+ parts

$41.224

100+ parts

$33.804

1k+ parts

-

10k+ parts

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1,778

$41.224

$33.804

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IDEA Electronic Components Group

UK . 1,544 parts In-Stock

1+ parts

$41.224

100+ parts

$39.163

1k+ parts

$37.102

10k+ parts

-

1,544

$41.224

$39.163

$37.102

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Corohmni

South Africa . 166 parts In-Stock

1+ parts

$60.349

100+ parts

-

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166

$60.349

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Infinite Electronics LLP (Excess)

. 6,239 parts In-Stock

1+ parts

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6,239

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DigiPath Technology Company

USA . 1,081 parts In-Stock

1+ parts

-

100+ parts

$37.168

1k+ parts

-

10k+ parts

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1,081

-

$37.168

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F67751AIPZR. This innovative microprocessor circuit boasts top-notch quality and reliability, perfect for a wide range of applications. With features like 6-channel ADC, 10-bit PWM channels, and advanced connectivity options, this device offers unparalleled value and benefits to customers looking for high-performance solutions. Trust Texas Instruments to deliver excellence in every aspect - explore the endless possibilities with the MSP430F67751AIPZR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into electronic circuits.

Maximum Supply Voltage: 3.6 V

Provides a wide operating voltage range for flexibility in different applications.

Bit Size: 16

A 16-bit architecture allows for enhanced processing capabilities and precision.

No. of Terminals: 100

Having a high number of terminals enables versatile connectivity options with other components.

Maximum Operating Temperature: 85 °C

Can operate efficiently in a wide range of temperatures, suitable for various environments.

CPU Family: MSP430

MSP430 processors are known for their low power consumption and high performance, making them ideal for battery-powered devices.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product can perform complex tasks and interface with various peripherals effectively.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67751AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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