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MSP430F67751AIPEU

Texas Instruments

MSP430F67751AIPEU by Texas Instruments

MSP430F67751AIPEU by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$11.604

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,622 parts In-Stock

1+ parts

$9.498

100+ parts

$7.743

1k+ parts

$5.162

10k+ parts

-

1,622

$9.498

$7.743

$5.162

-

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$13.710

100+ parts

$8.080

1k+ parts

$7.820

10k+ parts

$7.290

141

$13.710

$8.080

$7.820

$7.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,332 parts In-Stock

1+ parts

$9.023

100+ parts

-

1k+ parts

-

10k+ parts

-

3,332

$9.023

-

-

-

Vyrian

USA . 3,644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,644

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,211 parts In-Stock

1+ parts

$8.548

100+ parts

-

1k+ parts

-

10k+ parts

-

1,211

$8.548

-

-

-

Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

$69.208

100+ parts

-

1k+ parts

-

10k+ parts

-

1,935

$69.208

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-

-

DigiPath Technology Company

USA . 388 parts In-Stock

1+ parts

$76.207

100+ parts

$70.110

1k+ parts

-

10k+ parts

-

388

$76.207

$70.110

-

-

ChromeModa Solutions

Germany . 2,168 parts In-Stock

1+ parts

$77.762

100+ parts

$63.765

1k+ parts

-

10k+ parts

-

2,168

$77.762

$63.765

-

-

IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$77.762

100+ parts

$73.874

1k+ parts

$69.986

10k+ parts

-

43

$77.762

$73.874

$69.986

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Corohmni

South Africa . 872 parts In-Stock

1+ parts

$81.994

100+ parts

-

1k+ parts

-

10k+ parts

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872

$81.994

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-

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F67751AIPEU microprocessor circuit. Designed with precision and quality in mind, this versatile device is perfect for a wide range of applications, offering seamless connectivity and advanced features like analog-to-digital converters and pulse-width modulation channels. Whether you're looking to enhance your industrial automation system or boost the performance of your consumer electronics, this innovative solution delivers unmatched value and performance. Trust Texas Instruments to provide top-of-the-line products that exceed expectations and drive success in every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material which is suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

No. of Terminals: 128

Provides ample connectivity options for peripherals and external components.

ADC Channels: YES

Integrated Analog to Digital Converters for data conversion.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integration of various peripheral circuits for enhanced functionality.

Bus Compatibility: I2C; SPI; UART

Supports multiple communication protocols for versatile connectivity.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67751AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67751AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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