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MSP430F6769IPEUR

Texas Instruments

MSP430F6769IPEUR by Texas Instruments

MSP430F6769IPEUR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words, 32768 RAM bytes, and a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,645 parts In-Stock

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6,645

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Digiode

USA . 254 parts In-Stock

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254

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Distributors (Availability)

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$11.176

100+ parts

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306

$11.176

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One Stop Electronics

USA . 1,537 parts In-Stock

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$25.000

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1,537

$25.000

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Parana Technologies

USA . 991 parts In-Stock

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$46.348

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991

$46.348

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DigiPath Technology Company

USA . 2,325 parts In-Stock

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$51.034

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$46.952

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2,325

$51.034

$46.952

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ChromeModa Solutions

Germany . 2,062 parts In-Stock

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$52.076

100+ parts

$42.702

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2,062

$52.076

$42.702

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IDEA Electronic Components Group

UK . 1,673 parts In-Stock

1+ parts

$52.076

100+ parts

$49.472

1k+ parts

$46.868

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1,673

$52.076

$49.472

$46.868

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Corohmni

South Africa . 2,394 parts In-Stock

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$82.532

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2,394

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Corphita

USA . 778 parts In-Stock

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Microchip USA

USA . 373 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F6769IPEUR, a cutting-edge microprocessor circuit designed for a wide range of applications. With its advanced technology and top-notch quality, this compact device offers unparalleled performance and reliability. From IoT devices to consumer electronics, this versatile product delivers exceptional value and efficiency, making it the perfect choice for your next project. Experience the benefits of superior design and seamless integration with the MSP430 series from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable makes the product easy to assemble on circuit boards, allowing for efficient and cost-effective manufacturing processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, making the product suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape makes the product space-efficient and easy to integrate into various electronic devices.

Bit Size: 16

The 16-bit size provides a good balance between processing power and efficiency, making the product suitable for a variety of tasks.

Power Supplies (V): 2/3.3

The availability of multiple power supply options ensures compatibility with different voltage requirements, enhancing the product's versatility.

No. of Terminals: 128

With 128 terminals, the product offers plenty of connectivity options, allowing for versatile designs and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for high-density mounting and space-saving designs, ideal for compact electronic devices.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in various environmental conditions, making the product suitable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family offers a proven track record of reliability and efficiency, making the product a reliable choice for embedded systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in extreme cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and reliability in the connection, making the product suitable for harsh operating conditions.

ROM Words: 524288

With 524288 ROM words, the product offers ample storage for firmware and data, allowing for complex programming and functionality.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables a slim profile and compact design, making the product suitable for space-constrained applications.

Width: 14 mm

The compact width of 14 mm allows for efficient board layout and integration, making the product suitable for small form factor devices.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz provides fast processing speeds, making the product suitable for tasks that require quick data processing.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures reliable soldering during assembly, contributing to the product's overall quality and durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for robust solder joints, ensuring long-term reliability in demanding operating conditions.

Length: 20 mm

The compact length of 20 mm contributes to a small footprint and space-saving design, making the product ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit as a peripheral IC provides advanced functionality and processing power, enhancing the product's capabilities.

RAM Bytes: 32768

With 32768 RAM bytes, the product offers ample memory for data storage and manipulation, enabling complex computations and multitasking.

Technology: CMOS

The CMOS technology used in the product enables low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring reliable connections and long-term performance.

Maximum Supply Current: 11.75 mA

The low maximum supply current of 11.75 mA contributes to energy efficiency and extends battery life in portable electronics.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources, making the product easy to integrate into existing systems.

ROM Programmability: FLASH

The flash ROM programmability allows for easy firmware updates and customization, enabling flexibility and adaptability in design and functionality.

Bus Compatibility: I2C; SPI; UART

The I2C, SPI, and UART bus compatibility offers versatile communication options, allowing the product to interface with a wide range of external devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables high-density mounting and compact designs, making the product suitable for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Speed: 25 rpm

The speed of 25 rpm indicates the rotation rate of the product, which may be relevant for specific applications requiring rotational motion.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6769IPEUR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6769IPEUR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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