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MSP430F67691IPZ

Texas Instruments

MSP430F67691IPZ by Texas Instruments

MSP430F67691IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact FLATPACK package.

Median Price

$12.072

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,125 parts In-Stock

1+ parts

$12.072

100+ parts

$10.544

1k+ parts

$7.272

10k+ parts

-

2,125

$12.072

$10.544

$7.272

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,208 parts In-Stock

1+ parts

$11.468

100+ parts

-

1k+ parts

-

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1,208

$11.468

-

-

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Vyrian

USA . 7,871 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,871

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Electronics Depot

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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80

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,503 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

2,503

$10.748

-

-

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Corphita

USA . 4,381 parts In-Stock

1+ parts

$10.865

100+ parts

-

1k+ parts

-

10k+ parts

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4,381

$10.865

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-

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AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$15.020

100+ parts

-

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704

$15.020

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-

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Parana Technologies

USA . 622 parts In-Stock

1+ parts

$31.599

100+ parts

-

1k+ parts

$83.889

10k+ parts

-

622

$31.599

-

$83.889

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Microchip USA

USA . 2,718 parts In-Stock

1+ parts

$33.520

100+ parts

$33.040

1k+ parts

$32.800

10k+ parts

$32.560

2,718

$33.520

$33.040

$32.800

$32.560

DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$34.794

100+ parts

$32.010

1k+ parts

-

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1,167

$34.794

$32.010

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IDEA Electronic Components Group

UK . 2,186 parts In-Stock

1+ parts

$35.504

100+ parts

$33.729

1k+ parts

$31.954

10k+ parts

-

2,186

$35.504

$33.729

$31.954

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ChromeModa Solutions

Germany . 2,047 parts In-Stock

1+ parts

$35.504

100+ parts

$29.113

1k+ parts

-

10k+ parts

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2,047

$35.504

$29.113

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QUARKTWIN TECHNOLOGY LTD

USA . 12,965 parts In-Stock

1+ parts

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100+ parts

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12,965

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Component Stockers USA

USA . 1,349 parts In-Stock

1+ parts

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1,349

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Perfect Parts

USA . 68 parts In-Stock

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68

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Overview

Unlock endless possibilities with the MSP430F67691IPZ by Texas Instruments. This high-quality microprocessor circuit offers unparalleled performance and reliability, making it perfect for a wide range of applications. With its cutting-edge technology and superior design, this product provides customers with exceptional value, benefits, and advantages. Whether you're looking to enhance your industrial processes or develop innovative solutions, the MSP430F67691IPZ is the ideal choice to bring your ideas to life. Choose Texas Instruments for excellence in every detail.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on PCBs, saving space and making assembly simpler.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Bit Size: 16

The 16-bit size allows for higher processing capabilities and performance compared to smaller bit sizes.

Power Supplies (V): 2/3.3

The dual power supply options offer flexibility in voltage requirements, accommodating different system configurations.

No. of Terminals: 100

The high number of terminals allow for more connections and interfaces, enabling versatile functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables compact design and space-saving in electronic devices.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it an efficient choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in extreme cold environments without issues.

ADC Channels: YES

The presence of ADC channels enables the product to accurately convert analog signals to digital data, expanding its capabilities.

Terminal Position: QUAD

The quad terminal position allows for efficient soldering and secure connections on the PCB, enhancing reliability.

ROM Words: 524288

The large ROM capacity provides ample storage for program data, allowing for complex applications and software to be stored.

Maximum Seated Height: 1.6 mm

The low maximum seated height profile helps in achieving a slim and compact design for the overall product.

RAM Words: 32

The 32 RAM words provide temporary storage for data processing, enhancing the device's multitasking capabilities.

Width: 14 mm

The compact width dimension allows for efficient placement on the PCB while saving space.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures the product's components are not overheated during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability enables reliable soldering and connection during the manufacturing process.

Length: 14 mm

The small length dimension contributes to the product's compact form factor, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate in harsh industrial environments without performance degradation.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The microprocessor circuit in the peripheral IC provides enhanced processing capabilities and integrated functions for efficient operation.

RAM Bytes: 32768

The large RAM size allows for efficient data storage and manipulation, improving overall system performance.

Technology: CMOS

The CMOS technology utilized in the product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure soldering connections on the PCB, ensuring reliable electrical contact.

Maximum Supply Current: 11.75 mA

The low maximum supply current consumption contributes to energy efficiency and longer battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is a common standard, offering compatibility with various power sources and peripherals.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and fast updating of program data, enhancing the device's versatility.

Bus Compatibility: I2C; SPI; UART

The compatibility with I2C, SPI, and UART bus interfaces allows for seamless communication with different peripherals and devices.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enables high-density mounting on the PCB, saving space and reducing signal interference.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's level of resistance to moisture-related issues, ensuring reliability in diverse environmental conditions.

Speed: 25 rpm

The speed of 25 rpm indicates the product's processing capability and performance efficiency, suitable for various real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67691IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67691IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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