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MSP430F6768IPZ

Texas Instruments

MSP430F6768IPZ by Texas Instruments

MSP430F6768IPZ by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at up to 25 MHz, it has a supply voltage range of 1.8-3.3 V and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption and high clock frequency.

Median Price

$10.865

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,720 parts In-Stock

1+ parts

$10.865

100+ parts

$9.490

1k+ parts

$6.545

10k+ parts

-

2,720

$10.865

$9.490

$6.545

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,189 parts In-Stock

1+ parts

$10.322

100+ parts

-

1k+ parts

-

10k+ parts

-

3,189

$10.322

-

-

-

Vyrian

USA . 2,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,112

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 130 parts In-Stock

1+ parts

$9.778

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$9.778

-

-

-

Corohmni

South Africa . 2,089 parts In-Stock

1+ parts

$10.748

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

$10.748

-

-

-

AZTECH Wire

Italy . 1,195 parts In-Stock

1+ parts

$18.560

100+ parts

-

1k+ parts

-

10k+ parts

-

1,195

$18.560

-

-

-

Microchip USA

USA . 2,424 parts In-Stock

1+ parts

$30.170

100+ parts

$29.740

1k+ parts

$29.520

10k+ parts

$29.310

2,424

$30.170

$29.740

$29.520

$29.310

Parana Technologies

USA . 610 parts In-Stock

1+ parts

$43.115

100+ parts

-

1k+ parts

-

10k+ parts

-

610

$43.115

-

-

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DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$47.475

100+ parts

$43.677

1k+ parts

-

10k+ parts

-

1,167

$47.475

$43.677

-

-

ChromeModa Solutions

Germany . 6,241 parts In-Stock

1+ parts

$48.444

100+ parts

$39.724

1k+ parts

-

10k+ parts

-

6,241

$48.444

$39.724

-

-

IDEA Electronic Components Group

UK . 88 parts In-Stock

1+ parts

$48.444

100+ parts

$46.022

1k+ parts

$43.600

10k+ parts

-

88

$48.444

$46.022

$43.600

-

Overview

Unlock the power of innovation with the Texas Instruments MSP430F6768IPZ, a cutting-edge microprocessor circuit designed for a wide range of applications. With its advanced technology and high-quality construction, this device offers unparalleled performance and reliability. From industrial automation to consumer electronics, this versatile product delivers exceptional value and benefits to customers seeking a solution that combines efficiency, flexibility, and ease of use. Experience the difference with Texas Instruments and revolutionize your projects with the MSP430F6768IPZ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and enabling high-density designs.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage tolerance allows for versatile power supply options and compatibility with different systems.

Package Shape: SQUARE

The square shape makes the IC easy to handle and design with, fitting well within space-constrained layouts.

Bit Size: 16

Having a 16-bit architecture enables the IC to process data and instructions in larger chunks, improving overall performance.

Power Supplies (V): 2/3.3

Dual power supply compatibility enhances the IC's flexibility in different operating environments and voltage requirements.

No. of Terminals: 100

Having a higher number of terminals allows for more connections and functionalities, increasing the versatility of the IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers compactness, low profile height, and fine pitch for efficient PCB layout and connectivity.

Minimum Supply Voltage: 1.8 V

A lower minimum supply voltage ensures energy efficiency and operation in low-power modes, extending battery life.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can withstand harsh industrial environments and maintain stable performance.

CPU Family: MSP430

The MSP430 family is known for its low-power consumption, making this IC suitable for battery-powered applications and energy-efficient designs.

Minimum Operating Temperature: -40 °C

The IC can operate effectively in extremely cold conditions, ensuring reliability in diverse temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

The built-in ADC channels allow for analog signal conversion, enabling the IC to interface with sensors and other analog devices.

Terminal Position: QUAD

The quad-terminal position simplifies installation and ensures secure soldering connections for robust PCB assembly.

ROM Words: 524288

With a large ROM capacity, the IC can store a significant amount of program data and instructions, enabling complex functionalities.

Maximum Seated Height: 1.6 mm

The low seated height enables the IC to be used in slim devices and space-constrained applications without compromising performance.

RAM Words: 16

Although limited in capacity, the RAM allows for temporary data storage and efficient processing of dynamic information.

Width: 14 mm

The moderate width of the IC makes it compatible with standard PCB designs and spacing, facilitating easy integration into systems.

Maximum Clock Frequency: 25 MHz

A high clock frequency enables fast data processing and execution of instructions, enhancing the overall performance of the IC.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the IC's reliability during reflow soldering processes, ensuring proper bonding and functionality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering and assembly, ensuring secure connections and durability.

Length: 14 mm

The compact length of the IC contributes to its space-saving design, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh operating conditions and temperature fluctuations, ensuring long-term reliability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

As a microprocessor circuit, this IC can perform a variety of functions and interface with external peripherals, enhancing its versatility.

RAM Bytes: 16384

The larger RAM capacity allows for efficient data storage and manipulation, enabling complex algorithms and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides secure mechanical support and facilitates soldering during assembly, ensuring reliable connections.

Maximum Supply Current: 11.75 mA

With a moderate supply current, the IC operates efficiently and does not strain the power source, prolonging battery life in portable devices.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures stable and consistent power delivery to the IC, maintaining reliable operation under varying load conditions.

ROM Programmability: FLASH

Flash ROM allows for in-system programmability, enabling firmware updates and customization without the need for external programming tools.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus interfaces enhances the IC's connectivity options and compatibility with various communication protocols and devices.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and precise connections, contributing to compact PCB designs and efficient assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for standard handling and storage precautions to maintain IC reliability.

Speed: 25 rpm

This speed specification is likely for specific functionality or control within the IC, enhancing its capability for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6768IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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