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MSP430F6768AIPEU

Texas Instruments

MSP430F6768AIPEU by Texas Instruments

MSP430F6768AIPEU by Texas Instruments is a 16-bit microprocessor with 6-Ch 10-Bit ADC channels, 3 DMA channels, and 4 PWM channels. Ideal for industrial applications due to its wide temperature range (-40 to 85 °C) and multiple connectivity options (I2C, IRDA, SPI, UART). Features include ROM of 524288 words and RAM of 16384 bytes.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

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758

$12.976

$11.335

$7.817

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 777 parts In-Stock

1+ parts

$12.327

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-

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777

$12.327

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Vyrian

USA . 7,812 parts In-Stock

1+ parts

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7,812

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Distributors (Availability)

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Corphita

USA . 4,056 parts In-Stock

1+ parts

$11.678

100+ parts

-

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4,056

$11.678

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Corohmni

South Africa . 863 parts In-Stock

1+ parts

$12.585

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863

$12.585

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AZTECH Wire

Italy . 780 parts In-Stock

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$13.430

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780

$13.430

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Microchip USA

USA . 1,057 parts In-Stock

1+ parts

$40.900

100+ parts

$40.310

1k+ parts

$40.020

10k+ parts

$39.730

1,057

$40.900

$40.310

$40.020

$39.730

Parana Technologies

USA . 102 parts In-Stock

1+ parts

$44.878

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102

$44.878

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DigiPath Technology Company

USA . 100 parts In-Stock

1+ parts

$49.416

100+ parts

$45.463

1k+ parts

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100

$49.416

$45.463

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ChromeModa Solutions

Germany . 4,741 parts In-Stock

1+ parts

$50.425

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$41.348

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4,741

$50.425

$41.348

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IDEA Electronic Components Group

UK . 1,556 parts In-Stock

1+ parts

$50.425

100+ parts

$47.904

1k+ parts

$45.382

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1,556

$50.425

$47.904

$45.382

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430F6768AIPEU microprocessor circuit. Designed for industrial-grade applications, this 16-bit CPU family member offers unparalleled performance and reliability. With a wide range of peripherals including ADC channels, PWM channels, and connectivity options like I2C and SPI, this device is perfect for a variety of projects. Experience seamless operation and efficient power management with the MSP430F6768AIPEU, setting a new standard in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Allows for a lightweight and durable construction, making the product suitable for various applications.

Surface Mount: YES

Enables easy and efficient assembly on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.6 V

Provides a wide voltage range for compatibility with different power sources, enhancing flexibility in design.

Package Shape: RECTANGULAR

Facilitates space-efficient placement on PCBs, optimizing board layout and reducing footprint.

Bit Size: 16

Offers a high level of data processing capability, suitable for handling complex tasks and calculations efficiently.

No. of Terminals: 128

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enhances thermal performance and signal integrity, crucial for reliable operation in various environments.

Minimum Supply Voltage: 2.4 V

Allows for operation with lower power sources, promoting energy efficiency and extending battery life.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments, suitable for industrial applications.

CPU Family: MSP430

Utilizes a proven and efficient microcontroller architecture, offering a balance of performance and power efficiency.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6768AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6768AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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