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MSP430F67681IPZR

Texas Instruments

MSP430F67681IPZR by Texas Instruments

MSP430F67681IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.6 V, making it ideal for industrial applications requiring low power consumption and high performance in a compact form factor. With ADC channels, I2C/SPI/UART compatibility, and GULL WING terminals, this MICROPROCESSOR CIRCUIT is suitable for various embedded systems designs.

Median Price

$11.876

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,700 parts In-Stock

1+ parts

$8.551

100+ parts

$7.469

1k+ parts

$5.151

10k+ parts

-

2,700

$8.551

$7.469

$5.151

-

Mouser Electronics

USA . 6 parts In-Stock

1+ parts

$15.200

100+ parts

$9.760

1k+ parts

$8.060

10k+ parts

-

6

$15.200

$9.760

$8.060

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,286 parts In-Stock

1+ parts

$8.123

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$8.123

-

-

-

Vyrian

USA . 4,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,305

-

-

-

-

ComSIT Distribution GmbH

Germany . 635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

635

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,117 parts In-Stock

1+ parts

$7.696

100+ parts

-

1k+ parts

-

10k+ parts

-

4,117

$7.696

-

-

-

Corohmni

South Africa . 3,194 parts In-Stock

1+ parts

$9.696

100+ parts

-

1k+ parts

-

10k+ parts

-

3,194

$9.696

-

-

-

Microchip USA

USA . 2,510 parts In-Stock

1+ parts

$19.370

100+ parts

$19.100

1k+ parts

$18.960

10k+ parts

$18.820

2,510

$19.370

$19.100

$18.960

$18.820

Parana Technologies

USA . 461 parts In-Stock

1+ parts

$53.997

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$53.997

-

-

-

ChromeModa Solutions

Germany . 3,839 parts In-Stock

1+ parts

$60.671

100+ parts

$49.750

1k+ parts

-

10k+ parts

-

3,839

$60.671

$49.750

-

-

IDEA Electronic Components Group

UK . 117 parts In-Stock

1+ parts

$60.671

100+ parts

$57.637

1k+ parts

$54.604

10k+ parts

-

117

$60.671

$57.637

$54.604

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,063 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,063

-

-

-

-

DigiPath Technology Company

USA . 2,322 parts In-Stock

1+ parts

-

100+ parts

$54.701

1k+ parts

-

10k+ parts

-

2,322

-

$54.701

-

-

Overview

Upgrade your electronics with the MSP430F67681IPZR by Texas Instruments, a top-of-the-line microprocessor circuit designed to deliver unparalleled performance and reliability. With cutting-edge technology and a wide range of applications, this industrial-grade device offers customers seamless integration, power efficiency, and high-speed capabilities. Elevate your projects with the trusted quality and innovation that Texas Instruments is known for, and experience the difference in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and costs during production.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options without risking damage to the product.

Package Shape: SQUARE

Square shape helps in optimizing PCB layout and saving space in the overall design.

Bit Size: 16

Provides sufficient processing power for various tasks and applications.

Power Supplies (V): 2/3.3

Supports multiple voltage options, allowing compatibility with different power sources.

No. of Terminals: 100

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The style allows for easy integration into compact electronic devices and ensures efficient heat dissipation.

Minimum Supply Voltage: 1.8 V

Allows for operation in low power scenarios, conserving energy and extending battery life.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for industrial applications.

CPU Family: MSP430

Comes from a reliable and efficient CPU family known for its performance and low power consumption.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity, corrosion resistance, and reliability for long-term use.

ADC Channels: YES

Integrated Analog-to-Digital Converters allow for precise measurement and control of analog signals.

Terminal Position: QUAD

Quad terminal position enhances stability and reliability during PCB assembly and operation.

ROM Words: 524288

Large ROM capacity for storing program instructions and data, suitable for complex applications.

Maximum Seated Height: 1.6 mm

Low profile design helps in slim and compact product designs.

RAM Words: 16

Sufficient RAM capacity for temporary data storage and fast access during operation.

Width: 14 mm

Compact width dimensions allow for space-efficient PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during manufacturing, leading to reliable connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes without damage.

Length: 14 mm

Compact length dimensions contribute to space-saving designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring performance in harsh environments.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Integration of a microprocessor circuit enhances the functionality and processing capabilities of the product.

RAM Bytes: 16384

Expanded RAM capacity for efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high-speed performance, making the product energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections during PCB assembly.

Maximum Supply Current: 11.75 mA

Efficient supply current consumption for optimized power usage in various applications.

Nominal Supply Voltage: 3.3 V

Stable and standardized nominal supply voltage for consistent performance and compatibility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the firmware or software.

Bus Compatibility: I2C; SPI; UART

Support for multiple bus protocols enables versatile communication with other devices and peripherals.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB designs and precise connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the product can withstand standard moisture exposure during storage and assembly.

Speed: 25 rpm

High-speed processing capabilities for rapid data manipulation and response times in real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67681IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67681IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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