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MSP430F6767IPZ

Texas Instruments

MSP430F6767IPZ by Texas Instruments

MSP430F6767IPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at up to 25 MHz, it has ADC channels and supports I2C, SPI, UART buses. Ideal for industrial applications requiring low power consumption with a supply voltage range of 1.8-3.6 V.

Median Price

$8.068

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,710 parts In-Stock

1+ parts

$8.068

100+ parts

$6.578

1k+ parts

$4.385

10k+ parts

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1,710

$8.068

$6.578

$4.385

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.639

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100

$7.639

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Digiode

USA . 4,238 parts In-Stock

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$7.665

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4,238

$7.665

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Vyrian

USA . 6,283 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,249 parts In-Stock

1+ parts

$6.860

100+ parts

$6.688

1k+ parts

$6.654

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1,249

$6.860

$6.688

$6.654

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Corphita

USA . 989 parts In-Stock

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$7.261

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989

$7.261

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Corohmni

South Africa . 2,133 parts In-Stock

1+ parts

$7.639

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2,133

$7.639

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Continental Prestige Electronics

USA . 520 parts In-Stock

1+ parts

$7.639

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$7.486

520

$7.639

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$7.486

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.639

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50

$7.639

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Ampacity Inc.

Singapore . 1,338 parts In-Stock

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$14.930

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AZTECH Wire

Italy . 1,177 parts In-Stock

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$16.310

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Microchip USA

USA . 1,389 parts In-Stock

1+ parts

$22.070

100+ parts

$21.760

1k+ parts

$21.600

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$21.440

1,389

$22.070

$21.760

$21.600

$21.440

Parana Technologies

USA . 921 parts In-Stock

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$42.643

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921

$42.643

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DigiPath Technology Company

USA . 1,930 parts In-Stock

1+ parts

$46.956

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1,930

$46.956

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

1+ parts

$47.914

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$45.518

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$43.123

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2,119

$47.914

$45.518

$43.123

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ChromeModa Solutions

Germany . 639 parts In-Stock

1+ parts

$47.914

100+ parts

$39.289

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639

$47.914

$39.289

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QUARKTWIN TECHNOLOGY LTD

USA . 15,463 parts In-Stock

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Argo Parts USA

USA . 1,692 parts In-Stock

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1,692

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Overview

Unlock endless possibilities with the Texas Instruments MSP430F6767IPZ, a cutting-edge microprocessor circuit that offers unmatched performance and reliability. Designed with precision and expertise, this device is perfect for a wide range of applications in various industries. Get ready to experience seamless operation, enhanced efficiency, and unparalleled functionality with the MSP430 family. Trust in Texas Instruments to deliver top-notch quality and innovation, setting new standards in the world of microprocessors. Elevate your projects with the MSP430F6767IPZ and witness the difference it can make in your designs.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount - YES

Allows for easy and efficient integration onto circuit boards.

Maximum Supply Voltage - 3.6 V

Can operate efficiently at higher voltage levels, providing flexibility in power supply options.

Package Shape - SQUARE

Square shape allows for a compact design and efficient use of space on the PCB.

Bit Size - 16

16-bit architecture enables processing of larger chunks of data, suitable for various computing tasks.

Power Supplies (V) - 2/3.3

Supports multiple power supply options, providing versatility in system design.

No. of Terminals - 100

Sufficient number of terminals for connecting to external components and peripherals.

Package Style (Meter) - FLATPACK, LOW PROFILE, FINE PITCH

This style allows for a compact and low-profile design, suitable for space-constrained applications.

Minimum Supply Voltage - 1.8 V

Can operate at low voltage levels, enhancing energy efficiency in the system.

Maximum Operating Temperature - 85 °C

Capable of operating in high-temperature environments, suitable for industrial applications.

CPU Family - MSP430

Belonging to the MSP430 family ensures reliability and compatibility with other MSP430 devices.

Minimum Operating Temperature - -40 °C

Capable of operating in extremely low-temperature environments, suitable for different operating conditions.

Terminal Finish - NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable electrical connections.

ADC Channels - YES

Integrated ADC channels allow for analog signal processing, expanding the range of applications.

Terminal Position - QUAD

Quad terminal position enables easier soldering and connection to the PCB.

ROM Words - 262144

Large ROM capacity allows for storing a significant amount of program data.

Maximum Seated Height - 1.6 mm

Low profile design ensures easy integration into compact devices.

RAM Words - 32

Sufficient RAM capacity for buffer storage and data processing.

Width - 14 mm

Compact width allows for space-efficient placement on the PCB.

Maximum Clock Frequency - 25 MHz

High clock frequency enables fast processing speed, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s) - 30

Can withstand peak reflow temperature for a sufficient duration during manufacturing process.

Peak Reflow Temperature °C - 260

Capable of withstanding high reflow temperatures during assembly process.

Length - 14 mm

Compact length allows for efficient use of space on the PCB.

Temperature Grade - INDUSTRIAL

Designed to meet industrial temperature requirements, suitable for harsh environments.

Peripheral IC Type - MICROPROCESSOR CIRCUIT

Integrated microprocessor circuit enhances the functionality and processing capabilities of the device.

RAM Bytes - 32768

High RAM capacity for temporary data storage and efficient processing.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

Terminal Form - GULL WING

Gull wing terminals provide secure soldering connections and reliability.

Maximum Supply Current - 11.75 mA

Efficient power consumption and low supply current for energy-efficient operation.

Nominal Supply Voltage - 3.3 V

Stable and common supply voltage for reliable operation.

ROM Programmability - FLASH

Flash ROM programmability allows for easy and flexible programming of the device.

Bus Compatibility - I2C; SPI; UART

Support for multiple bus interfaces enhances connectivity and communication options.

Terminal Pitch - 0.5 mm

Fine pitch terminals enable high-density packaging and efficient layout on the PCB.

Moisture Sensitivity Level (MSL) - 3

MSL level 3 indicates the device can withstand standard moisture sensitivity levels during storage and handling.

Speed - 25 rpm

High processing speed of 25 rpm ensures efficient and responsive performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6767IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F6767IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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