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MSP430F6767AIPEU

Texas Instruments

MSP430F6767AIPEU by Texas Instruments

MSP430F6767AIPEU by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and WDT. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$9.925

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 758 parts In-Stock

1+ parts

$9.925

100+ parts

$8.091

1k+ parts

$5.394

10k+ parts

-

758

$9.925

$8.091

$5.394

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 102 parts In-Stock

1+ parts

$9.429

100+ parts

-

1k+ parts

-

10k+ parts

-

102

$9.429

-

-

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Vyrian

USA . 3,535 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,535

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 282 parts In-Stock

1+ parts

$8.684

100+ parts

-

1k+ parts

-

10k+ parts

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282

$8.684

-

-

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Corphita

USA . 914 parts In-Stock

1+ parts

$8.932

100+ parts

-

1k+ parts

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914

$8.932

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-

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AZTECH Wire

Italy . 95 parts In-Stock

1+ parts

$15.070

100+ parts

-

1k+ parts

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95

$15.070

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-

-

Parana Technologies

USA . 422 parts In-Stock

1+ parts

$28.013

100+ parts

$2,601.409

1k+ parts

$25.211

10k+ parts

-

422

$28.013

$2,601.409

$25.211

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Microchip USA

USA . 1,110 parts In-Stock

1+ parts

$28.220

100+ parts

$27.820

1k+ parts

$27.620

10k+ parts

$27.410

1,110

$28.220

$27.820

$27.620

$27.410

DigiPath Technology Company

USA . 188 parts In-Stock

1+ parts

$30.846

100+ parts

-

1k+ parts

-

10k+ parts

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188

$30.846

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-

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ChromeModa Solutions

Germany . 5,131 parts In-Stock

1+ parts

$31.475

100+ parts

$25.810

1k+ parts

-

10k+ parts

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5,131

$31.475

$25.810

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IDEA Electronic Components Group

UK . 1,379 parts In-Stock

1+ parts

$31.475

100+ parts

$29.901

1k+ parts

$28.328

10k+ parts

-

1,379

$31.475

$29.901

$28.328

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QUARKTWIN TECHNOLOGY LTD

USA . 6,121 parts In-Stock

1+ parts

-

100+ parts

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6,121

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Overview

Unlock limitless possibilities with the MSP430F6767AIPEU by Texas Instruments! Designed with precision and expertise, this microprocessor circuit offers unparalleled performance and reliability. Perfect for a wide range of applications, this device features an array of peripherals including a real-time clock, multiple timers, and analog-to-digital converters. With its low profile design and advanced technology, this IC provides seamless connectivity through I2C, IRDA, SPI, and UART interfaces. Experience the power of innovation with the MSP430F6767AIPEU and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input options and compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape provides a standard form factor for easy integration into existing designs and systems.

Bit Size: 16

The 16-bit architecture enables fast and efficient processing of data, suitable for a wide range of applications.

No. of Terminals: 128

The large number of terminals allows for versatile connectivity options and interface with external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers space-saving benefits and enhanced thermal performance.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage helps in reducing power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to function reliably in demanding industrial environments.

CPU Family: MSP430

The MSP430 CPU family is known for its energy efficiency and high performance, making it a reliable choice for various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can operate in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

The presence of ADC channels enables analog-to-digital conversion, essential for interfacing with sensors and external analog signals.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer and processing, enhancing overall system performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities suitable for complex applications.

RAM Bytes: 32768

With a significant amount of RAM bytes, the product can handle large amounts of data and multitasking effectively.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources and voltage regulation circuits.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options (I2C, IRDA, SPI, UART) provide flexibility for interfacing with various devices and communication protocols.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6767AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6767AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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