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MSP430F67651IPZ

Texas Instruments

MSP430F67651IPZ by Texas Instruments

MSP430F67651IPZ by Texas Instruments is a 16-bit microprocessor with 131072 ROM words and 16384 RAM bytes. Operating at -40 to 85 °C, it supports I2C, SPI, UART buses for industrial applications requiring low power consumption and high performance. With a compact square package style of 14x14 mm, it's ideal for space-constrained designs.

Median Price

$7.684

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 740 parts In-Stock

1+ parts

$7.684

100+ parts

$6.264

1k+ parts

$4.176

10k+ parts

-

740

$7.684

$6.264

$4.176

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 596 parts In-Stock

1+ parts

$7.300

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$7.300

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-

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Vyrian

USA . 6,657 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,657

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,620 parts In-Stock

1+ parts

$6.548

100+ parts

-

1k+ parts

-

10k+ parts

-

2,620

$6.548

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-

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Corphita

USA . 3,924 parts In-Stock

1+ parts

$6.916

100+ parts

-

1k+ parts

-

10k+ parts

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3,924

$6.916

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AZTECH Wire

Italy . 373 parts In-Stock

1+ parts

$19.850

100+ parts

-

1k+ parts

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10k+ parts

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373

$19.850

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Microchip USA

USA . 2,946 parts In-Stock

1+ parts

$21.020

100+ parts

$20.720

1k+ parts

$20.570

10k+ parts

$20.420

2,946

$21.020

$20.720

$20.570

$20.420

Parana Technologies

USA . 1,753 parts In-Stock

1+ parts

$60.921

100+ parts

-

1k+ parts

-

10k+ parts

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1,753

$60.921

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ChromeModa Solutions

Germany . 3,905 parts In-Stock

1+ parts

$68.451

100+ parts

$56.130

1k+ parts

-

10k+ parts

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3,905

$68.451

$56.130

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IDEA Electronic Components Group

UK . 714 parts In-Stock

1+ parts

$68.451

100+ parts

$65.028

1k+ parts

$61.606

10k+ parts

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714

$68.451

$65.028

$61.606

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DigiPath Technology Company

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

$61.715

1k+ parts

-

10k+ parts

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1,557

-

$61.715

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Overview

Unlock the power of innovation with the Texas Instruments MSP430F67651IPZ microprocessor circuit. Designed for industrial applications, this cutting-edge device offers 16-bit processing capabilities and a wide range of power supply options. With a compact square package style and advanced technology, this IC is perfect for a variety of functions. Trust in Texas Instruments' reputation for quality and efficiency, and discover the endless possibilities with the MSP430F67651IPZ. Elevate your projects with this versatile solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the components inside, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can handle higher power requirements and operate reliably.

Package Shape: SQUARE

The square package shape provides uniform orientation and easy handling during soldering and mounting on circuit boards.

Bit Size: 16

The 16-bit architecture enables faster processing and improved performance for applications that require higher computational power.

Power Supplies (V): 2/3.3

Support for dual power supply voltages (2V and 3.3V) offers flexibility and compatibility with a range of systems and devices.

No. of Terminals: 100

The 100 terminals provide ample connectivity options for interfacing with peripheral devices and external components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for a compact footprint, efficient use of space, and high-density mounting on PCBs.

Minimum Supply Voltage: 1.8 V

Even with a low minimum supply voltage of 1.8V, the product can operate reliably and efficiently, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh operating conditions with elevated temperatures.

CPU Family: MSP430

Being part of the MSP430 CPU family signifies high-quality design, advanced features, and compatibility with a wide range of development tools and software.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels allows for analog signal processing and conversion, expanding the product's application versatility.

RAM Words: 16

The 16 RAM words offer sufficient memory capacity for data storage and processing, supporting the product's computational capabilities.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing the product's efficiency.

ROM Programmability: FLASH

The Flash ROM programmability feature allows for easy and quick updates to the firmware, enhancing flexibility and adaptability in various application scenarios.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67651IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67651IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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