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MSP430F67621IPZ

Texas Instruments

MSP430F67621IPZ by Texas Instruments

MSP430F67621IPZ by Texas Instruments is a 100-terminal microprocessor circuit with 4-word RAM, operating b/w -40 to 85 °C. It features ADC channels, I2C/SPI/UART bus compatibility, and is ideal for industrial applications requiring low-profile, fine-pitch packages.

Median Price

$6.517

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,110 parts In-Stock

1+ parts

$6.517

100+ parts

$5.313

1k+ parts

$3.542

10k+ parts

-

8,110

$6.517

$5.313

$3.542

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,724 parts In-Stock

1+ parts

$6.191

100+ parts

-

1k+ parts

-

10k+ parts

-

4,724

$6.191

-

-

-

Bristol Electronics

USA . 80 parts In-Stock

1+ parts

$8.229

100+ parts

$3.566

1k+ parts

-

10k+ parts

-

80

$8.229

$3.566

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-

Vyrian

USA . 8,866 parts In-Stock

1+ parts

-

100+ parts

-

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8,866

-

-

-

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Dan-Mar Components

USA . 80 parts In-Stock

1+ parts

-

100+ parts

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-

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80

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 203 parts In-Stock

1+ parts

$5.865

100+ parts

-

1k+ parts

-

10k+ parts

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203

$5.865

-

-

-

AZTECH Wire

Italy . 1,054 parts In-Stock

1+ parts

$19.920

100+ parts

-

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-

10k+ parts

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1,054

$19.920

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-

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Corohmni

South Africa . 3,105 parts In-Stock

1+ parts

$43.220

100+ parts

-

1k+ parts

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3,105

$43.220

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Parana Technologies

USA . 528 parts In-Stock

1+ parts

$49.711

100+ parts

-

1k+ parts

-

10k+ parts

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528

$49.711

-

-

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ChromeModa Solutions

Germany . 88 parts In-Stock

1+ parts

$55.855

100+ parts

$45.801

1k+ parts

-

10k+ parts

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88

$55.855

$45.801

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IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$55.855

100+ parts

$53.062

1k+ parts

$50.270

10k+ parts

-

54

$55.855

$53.062

$50.270

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DigiPath Technology Company

USA . 1,203 parts In-Stock

1+ parts

-

100+ parts

$50.359

1k+ parts

-

10k+ parts

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1,203

-

$50.359

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Overview

Unleash the power of innovation with the Texas Instruments MSP430F67621IPZ microprocessor circuit. Designed with cutting-edge technology and unparalleled quality, this device offers a wide range of applications in the field of Other Function uPs,uCs & Peripheral ICs. With its compact design, low power consumption, and high performance capabilities, the MSP430F67621IPZ is the ideal solution for your industrial needs. Trust Texas Instruments to deliver superior products that exceed expectations and unlock endless possibilities for your projects. Upgrade to the MSP430F67621IPZ today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The ability to be surface mounted allows for easier and more efficient assembly, saving time and resources during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power requirements and compatibility with various systems.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures a wide range of compatibility with power sources while maintaining efficient operation.

CPU Family: MSP430

Being part of the MSP430 CPU family indicates high performance and reliability, suitable for demanding applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The inclusion of a microprocessor circuit enhances the functionality and processing capabilities of the product, making it versatile for various applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67621IPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

4096

RAM Words:

4

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67621IPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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