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MSP430F6749AIPEU

Texas Instruments

MSP430F6749AIPEU by Texas Instruments

MSP430F6749AIPEU by Texas Instruments is a 16-bit microprocessor with 128 terminals, operating at up to 0.032768 MHz. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR and RTC. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$12.976

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,842 parts In-Stock

1+ parts

$12.976

100+ parts

$11.335

1k+ parts

$7.817

10k+ parts

-

2,842

$12.976

$11.335

$7.817

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,446 parts In-Stock

1+ parts

$12.327

100+ parts

-

1k+ parts

-

10k+ parts

-

1,446

$12.327

-

-

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Vyrian

USA . 8,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,312

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 649 parts In-Stock

1+ parts

$10.440

100+ parts

-

1k+ parts

-

10k+ parts

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649

$10.440

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-

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Ampacity Inc.

Singapore . 2,506 parts In-Stock

1+ parts

$11.030

100+ parts

-

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2,506

$11.030

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Corphita

USA . 2,237 parts In-Stock

1+ parts

$11.678

100+ parts

-

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2,237

$11.678

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Corohmni

South Africa . 21 parts In-Stock

1+ parts

$12.585

100+ parts

-

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21

$12.585

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Parana Technologies

USA . 207 parts In-Stock

1+ parts

$34.958

100+ parts

-

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207

$34.958

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ChromeModa Solutions

Germany . 1,279 parts In-Stock

1+ parts

$39.279

100+ parts

$32.209

1k+ parts

-

10k+ parts

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1,279

$39.279

$32.209

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IDEA Electronic Components Group

UK . 784 parts In-Stock

1+ parts

$39.279

100+ parts

$37.315

1k+ parts

$35.351

10k+ parts

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784

$39.279

$37.315

$35.351

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DigiPath Technology Company

USA . 426 parts In-Stock

1+ parts

-

100+ parts

$35.414

1k+ parts

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426

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$35.414

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Overview

Unleash the power of innovation with the MSP430F6749AIPEU by Texas Instruments. This cutting-edge microprocessor circuit offers unparalleled performance and reliability, thanks to its advanced technology and industrial-grade construction. With a wide range of peripherals including ADC channels, DMA channels, and PWM channels, this device is perfect for a variety of applications. Whether you're designing IoT devices, smart sensors, or industrial control systems, the MSP430F6749AIPEU delivers the value, benefits, and advantages you need to bring your ideas to life. Upgrade your projects today and experience the difference that Texas Instruments quality can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this product can operate with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems and designs.

Bit Size: 16

With a bit size of 16, this product offers a good balance between processing power and energy efficiency.

No. of Terminals: 128

The high number of terminals provides flexibility in connecting external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style minimizes the space required for the product on the PCB, ideal for compact designs.

Minimum Supply Voltage: 2.4 V

The minimum supply voltage of 2.4V allows for operation in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance in various environmental conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low-power consumption and high performance, making it a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables operation in cold environments without sacrificing performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures good connectivity, corrosion resistance, and longer product lifespan.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels enables the product to accurately convert analog signals to digital data for processing.

DMA Channels: YES

The inclusion of Direct Memory Access channels enhances data transfer efficiency and reduces CPU workload, improving overall system performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, this product offers advanced processing capabilities, making it suitable for a variety of applications that require complex computations.

ROM Words: 524288

The large ROM word capacity of 524288 enhances the product's ability to store program instructions and data, accommodating larger software applications.

Width: 14 mm

The compact width of 14mm allows for easy integration into space-constrained designs or projects.

Peripherals: BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

The various peripherals such as Brown-Out Reset, Comparators, DMA controllers, Real-Time Clock, Timers, and Watchdog Timer enhance the product's functionality and versatility in different applications.

Maximum Clock Frequency: 0.032768 MHz

The maximum clock frequency of 0.032768 MHz ensures fast and efficient processing speed for time-sensitive applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and durability in harsh environmental conditions typically found in industrial settings.

RAM Bytes: 32768

With a large RAM byte capacity of 32768, the product can efficiently store and manipulate data during operation, enhancing performance.

Analog To Digital Convertors: 6-Ch 10-Bit

The 6-channel 10-bit Analog-to-Digital Converters allow for precise and accurate conversion of analog signals, making the product suitable for sensor interfacing and measurements.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration into existing systems.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The multiple connectivity options including I2C, IRDA, SPI, and UART enable seamless communication with other devices, expanding the product's versatility in networking applications.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and quick updates of firmware and software, enhancing the product's flexibility and adaptability.

No. of I/O Lines: 90

With 90 input/output lines, the product offers extensive connectivity options for interfacing with external devices and peripherals, making it suitable for complex applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6749AIPEU attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

90

No. of Terminals:

128

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6749AIPEU Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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