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MSP430F6747AIPZ

Texas Instruments

MSP430F6747AIPZ by Texas Instruments

MSP430F6747AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6 ADC channels, 3 DMA channels, and peripherals like BOR, RTC, and timers. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,910 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

1,910

$8.955

$7.301

$4.867

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,165 parts In-Stock

1+ parts

$8.507

100+ parts

-

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-

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3,165

$8.507

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-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.050

100+ parts

-

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10

$9.050

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Vyrian

USA . 8,931 parts In-Stock

1+ parts

-

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8,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,685 parts In-Stock

1+ parts

$7.610

100+ parts

$7.420

1k+ parts

$7.382

10k+ parts

-

1,685

$7.610

$7.420

$7.382

-

Corphita

USA . 4,503 parts In-Stock

1+ parts

$8.060

100+ parts

-

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4,503

$8.060

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Corohmni

South Africa . 696 parts In-Stock

1+ parts

$9.050

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696

$9.050

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$9.050

100+ parts

$8.869

1k+ parts

-

10k+ parts

-

2,000

$9.050

$8.869

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-

Continental Prestige Electronics

USA . 1,181 parts In-Stock

1+ parts

$9.050

100+ parts

-

1k+ parts

-

10k+ parts

$8.869

1,181

$9.050

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-

$8.869

Ampacity Inc.

Singapore . 1,866 parts In-Stock

1+ parts

$16.570

100+ parts

-

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1,866

$16.570

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AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$17.760

100+ parts

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610

$17.760

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Microchip USA

USA . 1,302 parts In-Stock

1+ parts

$32.760

100+ parts

$32.290

1k+ parts

$32.060

10k+ parts

$31.820

1,302

$32.760

$32.290

$32.060

$31.820

Parana Technologies

USA . 55 parts In-Stock

1+ parts

$66.568

100+ parts

-

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55

$66.568

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-

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DigiPath Technology Company

USA . 1,531 parts In-Stock

1+ parts

$73.299

100+ parts

$67.435

1k+ parts

-

10k+ parts

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1,531

$73.299

$67.435

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ChromeModa Solutions

Germany . 4,218 parts In-Stock

1+ parts

$74.795

100+ parts

$61.332

1k+ parts

-

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4,218

$74.795

$61.332

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IDEA Electronic Components Group

UK . 1,067 parts In-Stock

1+ parts

$74.795

100+ parts

$71.055

1k+ parts

$67.316

10k+ parts

-

1,067

$74.795

$71.055

$67.316

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QUARKTWIN TECHNOLOGY LTD

USA . 24,525 parts In-Stock

1+ parts

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24,525

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Argo Parts USA

USA . 3,543 parts In-Stock

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3,543

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Overview

Discover the power and versatility of the MSP430F6747AIPZ by Texas Instruments, a cutting-edge microprocessor circuit that offers unmatched quality and performance. With features like multiple ADC channels, DMA capabilities, and a variety of connectivity options, this industrial-grade device is perfect for a wide range of applications. Whether you're designing IoT devices, smart sensors, or industrial controls, the MSP430F6747AIPZ delivers the reliability and flexibility you need to bring your projects to life. Trust in Texas Instruments' reputation for excellence and revolutionize your designs with this high-quality microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the unit, making it suitable for a variety of environments.

Maximum Supply Voltage: 3.6 V

Having a maximum supply voltage of 3.6V allows for flexibility in power requirements and compatibility with different systems.

Bit Size: 16

A 16-bit processor allows for higher precision and performance in processing tasks compared to lower bit sizes.

ADC Channels: YES

Having Analog to Digital Convertor channels provides the ability to convert analog signals into digital data, enabling interfacing with various sensors and devices.

ROM Words: 262144

With a large ROM capacity of 262144 words, the product can store a significant amount of program data and instructions for efficient operation.

Maximum Clock Frequency: 32.768 MHz

A high maximum clock frequency allows for fast data processing and execution speeds, making the product suitable for applications requiring quick response times.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Being a microprocessor circuit, the product offers advanced processing capabilities and versatile functionality for a wide range of applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and standard power input for the product, ensuring reliable performance under various operating conditions.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

Having multiple connectivity options such as I2C, IRDA, SPI, and UART enables seamless communication and data exchange with other devices or systems.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F6747AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F6747AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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