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MSP430F67471IPZR

Texas Instruments

MSP430F67471IPZR by Texas Instruments

MSP430F67471IPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. Operating at -40 to 85 °C, it has ADC channels, I2C/SPI/UART bus compatibility, and consumes max 11.75 mA current. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$7.977

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,471 parts In-Stock

1+ parts

$6.344

100+ parts

$5.172

1k+ parts

$3.448

10k+ parts

-

2,471

$6.344

$5.172

$3.448

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$9.610

100+ parts

$7.860

1k+ parts

$5.900

10k+ parts

-

5

$9.610

$7.860

$5.900

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,443 parts In-Stock

1+ parts

$6.027

100+ parts

-

1k+ parts

-

10k+ parts

-

4,443

$6.027

-

-

-

Vyrian

USA . 8,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,138

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,970 parts In-Stock

1+ parts

$5.710

100+ parts

-

1k+ parts

-

10k+ parts

-

4,970

$5.710

-

-

-

Corohmni

South Africa . 59 parts In-Stock

1+ parts

$6.571

100+ parts

-

1k+ parts

-

10k+ parts

-

59

$6.571

-

-

-

Parana Technologies

USA . 982 parts In-Stock

1+ parts

$18.677

100+ parts

-

1k+ parts

$18.770

10k+ parts

-

982

$18.677

-

$18.770

-

ChromeModa Solutions

Germany . 1,980 parts In-Stock

1+ parts

$20.985

100+ parts

$17.208

1k+ parts

-

10k+ parts

-

1,980

$20.985

$17.208

-

-

IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$20.985

100+ parts

$19.936

1k+ parts

$18.886

10k+ parts

-

415

$20.985

$19.936

$18.886

-

Microchip USA

USA . 1,363 parts In-Stock

1+ parts

$30.560

100+ parts

$30.370

1k+ parts

$30.280

10k+ parts

$30.180

1,363

$30.560

$30.370

$30.280

$30.180

DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

-

100+ parts

$18.920

1k+ parts

-

10k+ parts

-

790

-

$18.920

-

-

Overview

Experience the next level of innovation with the MSP430F67471IPZR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. This versatile microprocessor circuit offers a wide range of applications, ensuring optimal performance and reliability. With its advanced technology and high-speed capabilities, this product provides unmatched value and benefits to customers looking for cutting-edge solutions. Upgrade your projects with the MSP430F67471IPZR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, providing flexibility in power supply options.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, especially in compact design applications.

Bit Size: 16

Offers sufficient processing capacity for various applications, enabling efficient operation and data processing.

Power Supplies (V): 2/3.3

Compatible with common voltage standards, ensuring seamless integration with existing systems.

No. of Terminals: 100

Provides ample connection points for interfacing with external components, enhancing versatility and functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates compact and space-efficient circuit board layout, particularly in constrained environments.

Minimum Supply Voltage: 1.8 V

Ensures efficient power consumption and operation at lower voltage levels, conserving energy and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

Suits a wide range of operating environments, making the product suitable for industrial applications with varying temperature conditions.

CPU Family: MSP430

Belongs to a reputable CPU family known for reliable performance and extensive support, ensuring compatibility and ease of integration.

Minimum Operating Temperature: -40 °C

Maintains functionality in extremely cold conditions, making the product suitable for outdoor or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections, enhancing reliability and longevity of the product.

ADC Channels: YES

Enables analog-to-digital conversion functionality, allowing for versatile input signal processing and sensor integration.

Terminal Position: QUAD

Facilitates easier soldering and assembly of the product onto circuit boards, streamlining the manufacturing process.

ROM Words: 262144

Offers ample storage capacity for program instructions and data, supporting complex algorithms and applications.

Maximum Seated Height: 1.6 mm

Provides a low-profile design that minimizes interference with adjacent components and enables sleek product aesthetics.

RAM Words: 32

Provides fast and efficient temporary data storage for computational tasks, enhancing overall system performance.

Width: 14 mm

Compact form factor enables easy integration into space-constrained designs, maximizing flexibility in product placement.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes soldering process by ensuring sufficient time for proper bonding, resulting in reliable connections and improved product quality.

Peak Reflow Temperature °C: 260

Supports high-temperature reflow soldering processes, ensuring secure and durable connections during assembly.

Length: 14 mm

Symmetrical dimensions facilitate uniform placement and alignment on circuit boards, enhancing ease of assembly.

Temperature Grade: INDUSTRIAL

Meets stringent industrial standards for temperature range and reliability, making it suitable for demanding industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporates advanced processing capabilities and integrated peripherals, offering a comprehensive solution for diverse application requirements.

RAM Bytes: 32768

Provides ample memory space for data storage and manipulation, supporting efficient operation of the product.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing energy efficiency and system reliability.

Terminal Form: GULL WING

Facilitates reliable mechanical and electrical connections during soldering, ensuring stable performance and durability.

Maximum Supply Current: 11.75 mA

Efficiently utilizes power resources while maintaining stable operation, minimizing energy waste and heat generation.

Nominal Supply Voltage: 3.3 V

Operates reliably within standard voltage levels, ensuring compatibility and stability in various power supply configurations.

ROM Programmability: FLASH

Supports flexible programming and reprogramming of ROM content, allowing for rapid prototyping and customization.

Bus Compatibility: I2C; SPI; UART

Offers versatile communication interfaces for seamless integration with various devices and peripherals, enhancing compatibility and connectivity.

Terminal Pitch: 0.5 mm

Provides precise and compact terminal spacing for efficient soldering and layout design, optimizing space utilization on circuit boards.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture exposure, requiring standard handling procedures to maintain product integrity and reliability.

Speed: 25 rpm

Supports fast data processing and computational tasks, enabling swift response times and efficient performance in real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67471IPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430F67471IPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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