Loading...

MSP430F67471AIPZ

Texas Instruments

MSP430F67471AIPZ by Texas Instruments

MSP430F67471AIPZ by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 32 RAM words. It features 6-Ch 10-Bit ADC channels, BOR, DMA(3), RTC, TIMER(4), WDT peripherals. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$8.955

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 24,210 parts In-Stock

1+ parts

$8.955

100+ parts

$7.301

1k+ parts

$4.867

10k+ parts

-

24,210

$8.955

$7.301

$4.867

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,054 parts In-Stock

1+ parts

$8.507

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$8.507

-

-

-

Vyrian

USA . 4,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,430

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,483 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

3,483

$8.060

-

-

-

AZTECH Wire

Italy . 1,157 parts In-Stock

1+ parts

$20.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,157

$20.190

-

-

-

Parana Technologies

USA . 138 parts In-Stock

1+ parts

$21.934

100+ parts

-

1k+ parts

$22.442

10k+ parts

-

138

$21.934

-

$22.442

-

DigiPath Technology Company

USA . 1,954 parts In-Stock

1+ parts

$24.152

100+ parts

$22.220

1k+ parts

-

10k+ parts

-

1,954

$24.152

$22.220

-

-

ChromeModa Solutions

Germany . 4,353 parts In-Stock

1+ parts

$24.645

100+ parts

$20.209

1k+ parts

-

10k+ parts

-

4,353

$24.645

$20.209

-

-

IDEA Electronic Components Group

UK . 2,111 parts In-Stock

1+ parts

$24.645

100+ parts

$23.413

1k+ parts

$22.180

10k+ parts

-

2,111

$24.645

$23.413

$22.180

-

Corohmni

South Africa . 138 parts In-Stock

1+ parts

$36.292

100+ parts

-

1k+ parts

-

10k+ parts

-

138

$36.292

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,532

-

-

-

-

Component Stockers USA

USA . 63 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

63

-

-

-

-

Overview

Unleash the power of innovation with the Texas Instruments MSP430F67471AIPZ. This cutting-edge microprocessor circuit offers unparalleled quality and reliability, making it a top choice for a wide range of applications. From industrial automation to consumer electronics, this device delivers exceptional performance and efficiency. With advanced features such as multiple ADC and DMA channels, as well as a variety of connectivity options, the MSP430F67471AIPZ provides endless possibilities for your projects. Trust in Texas Instruments to bring you the latest technology and unlock new opportunities for success. Invest in excellence with the MSP430F67471AIPZ today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the product.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power sources.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for this product.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product can operate effectively in harsh environments.

Analog To Digital Convertors: 6-Ch 10-Bit

The multiple ADC channels with 10-bit resolution enable precise analog to digital conversion, suitable for a variety of applications.

Connectivity: I2C(2), IRDA(4), SPI(6), UART(4)

The diverse connectivity options make it easy to integrate this product into various systems and interfaces.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67471AIPZ attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67471AIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20