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MSP430F67461AIPZR

Texas Instruments

MSP430F67461AIPZR by Texas Instruments

MSP430F67461AIPZR by Texas Instruments is a 16-bit microprocessor with 262144 ROM words and 16384 RAM bytes. It features 6-Ch 10-Bit ADC channels, PWM channels, and connectivity options like I2C, IRDA, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

$6.716

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,550 parts In-Stock

1+ parts

$6.716

100+ parts

$5.475

1k+ parts

$3.650

10k+ parts

-

3,550

$6.716

$5.475

$3.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,620 parts In-Stock

1+ parts

$6.380

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

$6.380

-

-

-

Vyrian

USA . 2,343 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,386 parts In-Stock

1+ parts

$5.710

100+ parts

$5.567

1k+ parts

$5.539

10k+ parts

-

3,386

$5.710

$5.567

$5.539

-

Corphita

USA . 414 parts In-Stock

1+ parts

$6.044

100+ parts

-

1k+ parts

-

10k+ parts

-

414

$6.044

-

-

-

AZTECH Wire

Italy . 56 parts In-Stock

1+ parts

$17.780

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$17.780

-

-

-

Corohmni

South Africa . 548 parts In-Stock

1+ parts

$18.093

100+ parts

-

1k+ parts

-

10k+ parts

-

548

$18.093

-

-

-

Microchip USA

USA . 2,799 parts In-Stock

1+ parts

$32.350

100+ parts

$32.150

1k+ parts

$32.050

10k+ parts

$31.950

2,799

$32.350

$32.150

$32.050

$31.950

Parana Technologies

USA . 1,461 parts In-Stock

1+ parts

$65.095

100+ parts

-

1k+ parts

-

10k+ parts

-

1,461

$65.095

-

-

-

DigiPath Technology Company

USA . 154 parts In-Stock

1+ parts

$71.678

100+ parts

$65.944

1k+ parts

-

10k+ parts

-

154

$71.678

$65.944

-

-

IDEA Electronic Components Group

UK . 1,127 parts In-Stock

1+ parts

$73.141

100+ parts

$69.484

1k+ parts

$65.827

10k+ parts

-

1,127

$73.141

$69.484

$65.827

-

ChromeModa Solutions

Germany . 86 parts In-Stock

1+ parts

$73.141

100+ parts

$59.976

1k+ parts

-

10k+ parts

-

86

$73.141

$59.976

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430F67461AIPZR, a high-quality microprocessor circuit that offers unmatched performance and reliability. Designed by a trusted manufacturer, this product is ideal for various applications in the industry, from IoT devices to automation systems. With advanced features like multiple ADC channels, DMA support, and PWM channels, this microprocessor provides value beyond measure. Experience seamless connectivity with I2C, IRDA, SPI, and UART interfaces, making integration effortless. Trust in the MSP430 family for innovative solutions and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a PCB.

Maximum Supply Voltage: 3.6 V

The high supply voltage range provides flexibility in power supply options for the product.

Package Shape: SQUARE

Square shape helps in efficient layout and space utilization on the PCB.

Bit Size: 16

The 16-bit architecture provides enhanced processing capabilities for the product.

No. of Terminals: 100

Ample number of terminals allow for versatile connectivity options with other components.

Minimum Supply Voltage: 2.4 V

Low minimum supply voltage enables operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in a diverse range of environmental conditions.

CPU Family: MSP430

Being part of the MSP430 family, the product benefits from efficient power consumption and performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a built-in microprocessor circuit enhances the overall functionality and processing capabilities of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs MSP430F67461AIPZR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Address Bus Width:

0

Bit Size:

16

Bus Compatibility:

I2C; SPI; UART

CPU Family:

MSP430

Maximum Clock Frequency:

.032768 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

62

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

RAM Words:

16

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA(4), SPI(6), UART(4)

Peripherals:

BOR, COMPARATOR(3), DMA(3), RTC, TIMER(4), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

MSP430F67461AIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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