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MSC1213Y4PAGRG4

Texas Instruments

MSC1213Y4PAGRG4 by Texas Instruments

The Texas Instruments MSC1213Y4PAGRG4 microcontroller features 8-bit CPU, 16-bit address bus, and 40 MHz clock frequency. Ideal for automotive applications with ADC/DAC channels, ROM of 16384 words, and operating temperature range from -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,166 parts In-Stock

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5,166

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Digiode

USA . 1,140 parts In-Stock

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1,140

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Distributors (Availability)

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AZTECH Wire

Italy . 386 parts In-Stock

1+ parts

$16.442

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-

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386

$16.442

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One Stop Electronics

USA . 887 parts In-Stock

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$24.000

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887

$24.000

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Parana Technologies

USA . 1,933 parts In-Stock

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$38.441

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1,933

$38.441

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DigiPath Technology Company

USA . 1,082 parts In-Stock

1+ parts

$42.328

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1,082

$42.328

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ChromeModa Solutions

Germany . 754 parts In-Stock

1+ parts

$43.192

100+ parts

$35.417

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754

$43.192

$35.417

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IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$43.192

100+ parts

$41.032

1k+ parts

$38.873

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417

$43.192

$41.032

$38.873

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Component Stockers USA

USA . 665 parts In-Stock

1+ parts

$99.990

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665

$99.990

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Corphita

USA . 1,076 parts In-Stock

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1,076

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Microchip USA

USA . 330 parts In-Stock

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330

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Overview

Unlock the power of innovative technology with the MSC1213Y4PAGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with value and benefits that go beyond just functionality. Discover how the MSC1213Y4PAGRG4 can elevate your projects and streamline your processes today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to external elements, making this microcontroller suitable for various environments.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options.

Bit Size: 8

8-bit architecture provides sufficient processing power for a wide range of applications while keeping costs efficient.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and quick updates to the program memory, improving flexibility and adaptability.

Technical Specifications

Microcontrollers MSC1213Y4PAGRG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.7V MINIMUM SUPPLY

Address Bus Width:

16

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

40 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1280

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Trade Compliance

MSC1213Y4PAGRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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