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LM4F232H5QCFIG

Texas Instruments

LM4F232H5QCFIG by Texas Instruments

LM4F232H5QCFIG by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It features 22-Ch 12-Bit ADC channels, 16 PWM channels, and connectivity options like CAN, I2C, SPI, UART, and USB. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,636 parts In-Stock

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4,636

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Vyrian

USA . 2,916 parts In-Stock

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2,916

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Distributors (Availability)

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AZTECH Wire

Italy . 603 parts In-Stock

1+ parts

$19.123

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603

$19.123

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One Stop Electronics

USA . 1,122 parts In-Stock

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$33.000

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$33.000

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Parana Technologies

USA . 2,093 parts In-Stock

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$33.901

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$136.872

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2,093

$33.901

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$136.872

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DigiPath Technology Company

USA . 1,094 parts In-Stock

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$37.329

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$34.343

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1,094

$37.329

$34.343

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ChromeModa Solutions

Germany . 4,742 parts In-Stock

1+ parts

$38.091

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$31.235

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4,742

$38.091

$31.235

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IDEA Electronic Components Group

UK . 1,520 parts In-Stock

1+ parts

$38.091

100+ parts

$36.186

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$34.282

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1,520

$38.091

$36.186

$34.282

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$38.357

100+ parts

$37.973

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$36.439

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2,000

$38.357

$37.973

$36.439

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Corphita

USA . 4,792 parts In-Stock

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Microchip USA

USA . 210 parts In-Stock

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Overview

Unleash the power of innovation with the LM4F232H5QCFIG by Texas Instruments, a top-of-the-line microcontroller designed to elevate your projects to new heights. With cutting-edge technology and exceptional quality, Texas Instruments is known for delivering reliable and high-performance components. This versatile microcontroller is perfect for a wide range of applications, offering unmatched value and benefits to customers. Whether you're working on robotics, IoT devices, or industrial automation, the LM4F232H5QCFIG will exceed your expectations and help bring your ideas to life. Choose Texas Instruments for excellence in microcontrollers and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding extra weight or compromising on durability.

Maximum Supply Voltage: 1.32 V

Being able to handle a maximum supply voltage of 1.32V allows for flexibility in power supply options and compatibility with different voltage sources.

Bit Size: 32

With a 32-bit architecture, the microcontroller can perform complex calculations and handle larger data sets efficiently.

CPU Family: CORTEX-M4F

Being part of the CORTEX-M4F CPU family ensures high performance and versatility in processing capabilities.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast processing speeds and real-time operation in demanding applications.

RAM Bytes: 32768

With 32KB of RAM, the microcontroller can store and access a significant amount of data quickly, enabling efficient multitasking and memory operation.

Analog To Digital Convertors: 22-Ch 12-Bit

Having 22 analog to digital conversion channels with 12-bit resolution enables accurate and precise measurement of analog signals, essential for sensor interfacing and signal processing.

Connectivity: CAN(2), I2C(6), IRDA, LIN, MICROWIRE, QEI(2), SPI, SSI(4), UART(8), USB

The wide range of connectivity options allows for versatile communication with other devices and networks, making the microcontroller suitable for diverse IoT and embedded applications.

Technical Specifications

Microcontrollers LM4F232H5QCFIG attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

69

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, LIN, MICROWIRE, QEI(2), SPI, SSI(4), UART(8), USB

Peripherals:

BOR, COMPARATOR(3), DMA(32), POR, PWM(16), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

22-Ch 12-Bit

Trade Compliance

LM4F232H5QCFIG Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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