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LM3S2965-IBZ50-A2

Texas Instruments

LM3S2965-IBZ50-A2 by Texas Instruments

LM3S2965-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max frequency of 50 MHz, features 4 ADC channels, and offers connectivity options like CAN, I2C, SSI, and UART. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$26.528

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 337 parts In-Stock

1+ parts

-

100+ parts

$23.580

1k+ parts

$21.100

10k+ parts

$19.860

337

-

$23.580

$21.100

$19.860

Verical

USA . 337 parts In-Stock

1+ parts

-

100+ parts

$29.475

1k+ parts

$26.375

10k+ parts

$24.825

337

-

$29.475

$26.375

$24.825

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,495 parts In-Stock

1+ parts

$24.890

100+ parts

-

1k+ parts

-

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3,495

$24.890

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Vyrian

USA . 8,549 parts In-Stock

1+ parts

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8,549

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,526 parts In-Stock

1+ parts

$23.580

100+ parts

-

1k+ parts

-

10k+ parts

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1,526

$23.580

-

-

-

Component Stockers USA

USA . 558 parts In-Stock

1+ parts

$27.190

100+ parts

$25.560

1k+ parts

-

10k+ parts

-

558

$27.190

$25.560

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$28.989

100+ parts

$26.380

1k+ parts

$23.771

10k+ parts

-

3,000

$28.989

$26.380

$23.771

-

Parana Technologies

USA . 688 parts In-Stock

1+ parts

$55.976

100+ parts

-

1k+ parts

-

10k+ parts

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688

$55.976

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-

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DigiPath Technology Company

USA . 1,446 parts In-Stock

1+ parts

$61.636

100+ parts

$56.705

1k+ parts

-

10k+ parts

-

1,446

$61.636

$56.705

-

-

ChromeModa Solutions

Germany . 4,665 parts In-Stock

1+ parts

$62.894

100+ parts

$51.573

1k+ parts

-

10k+ parts

-

4,665

$62.894

$51.573

-

-

IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$62.894

100+ parts

$59.749

1k+ parts

$56.605

10k+ parts

-

2,298

$62.894

$59.749

$56.605

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,226 parts In-Stock

1+ parts

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11,226

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

1+ parts

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100+ parts

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9,000

-

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Microchip USA

USA . 4,213 parts In-Stock

1+ parts

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4,213

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Kepictronics

USA . 1,840 parts In-Stock

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1,840

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Overview

Elevate your projects with the LM3S2965-IBZ50-A2 by Texas Instruments, a top-tier microcontroller that boasts industry-leading quality and reliability. From its cutting-edge technology to its versatile applications in various industries, this powerhouse device offers unmatched value to customers. With advanced features like integrated cache, multiple PWM channels, and low power mode, this microcontroller delivers optimal performance while maintaining efficiency. Trust in Texas Instruments to provide you with a superior product that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Integrated Cache: YES

Having an integrated cache improves the overall performance of the microcontroller by reducing access times to frequently used data.

Maximum Supply Voltage: 2.75 V

A moderate maximum supply voltage ensures safe operation and flexibility in various voltage environments.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space and easy integration into circuit designs.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sizes and complex computations efficiently.

Power Supplies (V): 2.5,3.3

Having multiple power supply options allows for compatibility with a wide range of systems and voltage requirements.

No. of Terminals: 108

A higher number of terminals provide more connectivity options and flexibility in circuit design.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style offers a compact and robust design suitable for space-constrained applications.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage ensures energy efficiency and reliable performance in low voltage scenarios.

Maximum Operating Temperature: 85 °C

The microcontroller can operate effectively in high-temperature environments without risking damage.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family ensures high performance and low power consumption for the microcontroller.

Minimum Operating Temperature: -40 °C

The microcontroller remains operational even in extremely cold conditions, making it suitable for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals in the system.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to solder and mount the microcontroller onto a circuit board.

ROM Words: 262144

Having a large ROM capacity allows for storing a significant amount of program data for the microcontroller.

Maximum Seated Height: 1.5 mm

The low seated height ensures compatibility with compact designs and minimizes space requirements.

Width: 10 mm

The compact width dimension allows for easy integration into various electronic devices and systems.

Boundary Scan: YES

Boundary scan capability allows for comprehensive testing and debugging of the microcontroller during production and maintenance.

Peripherals: PWM(6), QEI, TIMER(4), WDT

The presence of multiple peripherals enhances the functionality and versatility of the microcontroller for different applications.

Maximum Clock Frequency: 50 MHz

A high maximum clock frequency enables fast and efficient processing of instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand high reflow temperatures for a specified time, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

The peak reflow temperature tolerance ensures the microcontroller's reliability during the soldering process.

Length: 10 mm

The compact length dimension allows for space-efficient placement on circuit boards and in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature performance ensures stable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller design provide efficient processing and control capabilities for various applications.

No. of Timers: 4

Having multiple timers allows for precise timing control and synchronization in the system.

RAM Bytes: 65536

With a large RAM capacity, the microcontroller can efficiently handle data processing and storage requirements in the system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form simplifies the soldering and mounting process, ensuring secure connections on the circuit board.

Analog To Digital Convertors: 4-Ch 10-Bit

The 4-channel 10-bit ADC provides accurate and reliable conversion of analog signals to digital data for processing.

Nominal Supply Voltage: 2.5 V

A stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

No. of Serial I/Os: 9

Having multiple serial I/O interfaces allows for versatile connectivity options and communication protocols.

PWM Channels: YES

Pulse-width modulation channels enable precise control of signals and outputs for various applications.

Connectivity: CAN(2), I2C(2), SSI(2), UART(3)

The multiple connectivity options provide flexibility in interfacing with external devices and communication networks.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and fast programming of the microcontroller with updated firmware and applications.

Terminal Pitch: 0.8 mm

The fine terminal pitch enables compact packaging and high-density mounting on circuit boards for space-saving designs.

Format: FIXED POINT

The fixed-point format offers efficient numerical representation and processing capabilities for arithmetic operations.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller is suitable for reflow soldering and moisture-resistant packaging.

Speed: 50 rpm

With a maximum speed of 50 rpm, the microcontroller can efficiently process instructions and data at a high rate.

Low Power Mode: YES

The low power mode feature helps reduce power consumption during idle or low-load situations, increasing energy efficiency.

On Chip Program ROM Width: 8

The wide program ROM width allows for storing a large number of instructions and program data for efficient execution.

No. of I/O Lines: 56

Having a high number of I/O lines provides versatile input and output capabilities for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LM3S2965-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V IO SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

56

No. of Serial I/Os:

9

No. of Terminals:

108

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SSI(2), UART(3)

Peripherals:

PWM(6), QEI, TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S2965-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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