Loading...

LM3S9B96-IQC80-C3

Texas Instruments

LM3S9B96-IQC80-C3 by Texas Instruments

LM3S9B96-IQC80-C3 by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. Operating at a max clock frequency of 80 MHz, it is ideal for industrial applications requiring high-speed processing and multiple PWM channels. With a wide temperature range from -40 to 85°C, this microcontroller offers reliability in harsh environments.

Median Price

$461.540

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 8 parts In-Stock

1+ parts

$461.540

100+ parts

$346.150

1k+ parts

$300.000

10k+ parts

-

8

$461.540

$346.150

$300.000

-

Vyrian

USA . 7,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,932

-

-

-

-

Digiode

USA . 4,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,997

-

-

-

-

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

94

-

-

-

-

Bristol Electronics

USA . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

ABC Electronics Ltd.

UK . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$10.233

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$10.233

-

-

-

Parana Technologies

USA . 2,339 parts In-Stock

1+ parts

$18.996

100+ parts

-

1k+ parts

$19.054

10k+ parts

-

2,339

$18.996

-

$19.054

-

One Stop Electronics

USA . 1,230 parts In-Stock

1+ parts

$20.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

$20.000

-

-

-

ChromeModa Solutions

Germany . 2,730 parts In-Stock

1+ parts

$21.344

100+ parts

$17.502

1k+ parts

-

10k+ parts

-

2,730

$21.344

$17.502

-

-

IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$21.344

100+ parts

$20.277

1k+ parts

$19.210

10k+ parts

-

1,072

$21.344

$20.277

$19.210

-

Ampacity Inc.

Singapore . 1,581 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,581

$22.000

-

-

-

Continental Prestige Electronics

USA . 2,955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,955

-

-

-

-

Argo Parts USA

USA . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

-

-

-

-

Corphita

USA . 1,919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,919

-

-

-

-

DigiPath Technology Company

USA . 889 parts In-Stock

1+ parts

-

100+ parts

$19.244

1k+ parts

-

10k+ parts

-

889

-

$19.244

-

-

Microchip USA

USA . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

426

-

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Benley Electronics

USA . 15 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15

-

-

-

-

Overview

Experience the power of innovation with the LM3S9B96-IQC80-C3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers superior quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this product provides customers with enhanced efficiency and functionality. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and elevates your projects to the next level. Unlock the full potential of your designs with the LM3S9B96-IQC80-C3 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material suitable for a variety of applications

Surface Mount: YES

Saves space on the PCB and allows for efficient assembly

Maximum Supply Voltage: 3.6 V

Can handle higher voltages which provides flexibility in power supply options

Package Shape: SQUARE

Optimal shape for efficient use of space on the PCB

Bit Size: 32

Higher bit size allows for complex operations and calculations

Power Supplies (V): 1.2,3.3

Supports multiple voltage options for different power requirements

No. of Terminals: 100

Sufficient number of terminals for versatile connectivity options

Package Style (Meter): FLATPACK

Flatpack design for easy integration into electronic devices

Minimum Supply Voltage: 3 V

Can operate at lower voltages for power efficiency

ADC Channels: YES

Includes Analog-to-Digital Converter for interfacing with analog sensors

Terminal Position: QUAD

Quad terminal position for stable mechanical connections

ROM Words: 262144

Large ROM size allows for storing a significant amount of program data

Maximum Seated Height: 1.6 mm

Low profile design for slim devices

Width: 14 mm

Compact width for space-saving designs

Maximum Clock Frequency: 80 MHz

High clock frequency for fast processing speeds

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for specified time

Peak Reflow Temperature °C: 260

Can handle high reflow temperatures for soldering processes

Length: 14 mm

Compact length for space-saving designs

Temperature Grade: INDUSTRIAL

Suitable for industrial temperature ranges and harsh environments

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient processing and control tasks

RAM Bytes: 98304

Large RAM size for storing and accessing data during operation

Technology: CMOS

CMOS technology for low power consumption and high noise immunity

Terminal Form: GULL WING

Gull wing terminals for secure and reliable solder connections

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent performance

PWM Channels: YES

Includes Pulse Width Modulation channels for precise control of output signals

ROM Programmability: FLASH

Flash ROM for convenient and fast program updates

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout and design

Moisture Sensitivity Level (MSL): 3

MSL level 3 for safe handling and storage in humid environments

Speed: 80 rpm

Operates at a speed of 80 rotations per minute

No. of I/O Lines: 65

Sufficient number of I/O lines for interfacing with external devices

Technical Specifications

Microcontrollers LM3S9B96-IQC80-C3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B96-IQC80-C3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 19