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LM3S102-EGZ20-C2T

Texas Instruments

LM3S102-EGZ20-C2T by Texas Instruments

Texas Instruments LM3S102-EGZ20-C2T is a 32-bit microcontroller with 3.3V power supply, 2048 bytes RAM, and 8192 ROM words. Ideal for industrial applications, it features ADC channels, PWM support, and operates at temperatures ranging from -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,643 parts In-Stock

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6,643

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Digiode

USA . 3,572 parts In-Stock

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3,572

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 130 parts In-Stock

1+ parts

$6.000

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130

$6.000

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One Stop Electronics

USA . 129 parts In-Stock

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$10.000

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129

$10.000

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Semicontronic

India . 1,315 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

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$14.550

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1,315

$15.000

$14.625

$14.550

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AZTECH Wire

Italy . 479 parts In-Stock

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$16.173

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479

$16.173

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Parana Technologies

USA . 1,361 parts In-Stock

1+ parts

$52.081

100+ parts

$4,836.513

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$46.873

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1,361

$52.081

$4,836.513

$46.873

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DigiPath Technology Company

USA . 200 parts In-Stock

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$57.348

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200

$57.348

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ChromeModa Solutions

Germany . 3,653 parts In-Stock

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$58.518

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$47.985

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3,653

$58.518

$47.985

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IDEA Electronic Components Group

UK . 567 parts In-Stock

1+ parts

$58.518

100+ parts

$55.592

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$52.666

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567

$58.518

$55.592

$52.666

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Continental Prestige Electronics

USA . 4,278 parts In-Stock

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Argo Parts USA

USA . 3,268 parts In-Stock

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Microchip USA

USA . 1,116 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Corphita

USA . 200 parts In-Stock

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200

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Overview

Discover the LM3S102-EGZ20-C2T by Texas Instruments, a top-quality microcontroller that offers unmatched performance and reliability. With its cutting-edge technology and industrial-grade design, this versatile chip is perfect for a wide range of applications. From embedded systems to IoT devices, this microcontroller delivers exceptional value, efficiency, and flexibility to meet your project needs. Trust Texas Instruments for superior products that exceed expectations and drive innovation in the industry. Choose the LM3S102-EGZ20-C2T and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes this microcontroller compact and easily mountable on PCBs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power source selection.

Package Shape: SQUARE

The square package shape provides a space-efficient design for compact electronic devices.

Bit Size: 32

A 32-bit architecture allows for high-performance computing and processing capabilities.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of electronic components.

No. of Terminals: 48

With 48 terminals, this microcontroller offers ample connectivity options for peripherals and sensors.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers durability and protection for the microcontroller.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures reliable operation even under low-power conditions.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows for use in rugged industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this microcontroller suitable for extreme climate conditions.

ADC Channels: YES

Analog-to-digital converter channels enable precise analog signal processing.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections in the application.

ROM Words: 8192

With 8192 ROM words, this microcontroller offers ample memory capacity for program storage.

Maximum Seated Height: 1 mm

The low maximum seated height ensures compatibility with slim and compact device designs.

Width: 6.875 mm

The narrow width makes this microcontroller suitable for space-constrained applications.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency allows for fast data processing and execution speed.

Length: 6.875 mm

The short length of this microcontroller enables a compact and sleek design in the final product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in this microcontroller offers efficient and streamlined data processing.

RAM Bytes: 2048

With 2048 RAM bytes, this microcontroller provides sufficient memory for data storage and manipulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity in this microcontroller.

Terminal Form: NO LEAD

No-lead terminal form ensures ease of installation and compatibility with modern soldering techniques.

Maximum Supply Current: 50 mA

The low maximum supply current requirement reduces power consumption and heat generation.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable and efficient operation of this microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog output signals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the microcontroller's firmware.

Terminal Pitch: 0.5 mm

The small terminal pitch provides high-density connectivity options for peripherals and external devices.

Speed: 20 rpm

With a speed of 20 rpm, this microcontroller can handle real-time processing and control tasks efficiently.

No. of I/O Lines: 18

The 18 I/O lines offer versatile input/output options for interfacing with external devices and components.

Technical Specifications

Microcontrollers LM3S102-EGZ20-C2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N48

Length:

6.875 mm

No. of I/O Lines:

18

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.875 mm

Peripheral IC Type:

Trade Compliance

LM3S102-EGZ20-C2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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