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LM3S1968-IQC50-A2

Texas Instruments

LM3S1968-IQC50-A2 by Texas Instruments

Texas Instruments LM3S1968-IQC50-A2 microcontroller features 32-bit CPU, 262144 ROM words, and 65536 RAM bytes. Ideal for industrial applications, it offers 8 ADC channels, PWM(6), QEI(2), TIMER(4), WDT peripherals, and operates at a max clock frequency of 0.032 MHz.

Median Price

$41.110

Lifecycle Status

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6

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1k+

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DigiKey

USA . 769 parts In-Stock

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$41.110

100+ parts

$29.662

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$28.465

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769

$41.110

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$28.465

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Mouser Electronics

USA . 436 parts In-Stock

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$41.110

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$29.660

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$28.460

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436

$41.110

$29.660

$28.460

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Nova Conductors

Japan . 75 parts In-Stock

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$27.320

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$27.320

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Digiode

USA . 763 parts In-Stock

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$29.802

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Vyrian

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Chip Stock

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Andel Nordic

Denmark . 2,038 parts In-Stock

1+ parts

$2.916

100+ parts

-

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$2.799

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$2.799

2,038

$2.916

-

$2.799

$2.799

AZTECH Wire

Italy . 597 parts In-Stock

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$5.841

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Corohmni

South Africa . 111 parts In-Stock

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$19.657

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$19.657

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Ampacity Inc.

Singapore . 182 parts In-Stock

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$26.660

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Aranea Global

USA . 500 parts In-Stock

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$26.774

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$25.703

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$26.774

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Continental Prestige Electronics

USA . 2,489 parts In-Stock

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$27.320

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Corphita

USA . 4,852 parts In-Stock

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$28.233

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Parana Technologies

USA . 198 parts In-Stock

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$68.599

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Microchip USA

USA . 2,028 parts In-Stock

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$72.150

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$70.900

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$70.270

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$69.640

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$72.150

$70.900

$70.270

$69.640

DigiPath Technology Company

USA . 1,253 parts In-Stock

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$75.535

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

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$73.223

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$69.369

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$77.077

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ChromeModa Solutions

Germany . 914 parts In-Stock

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$77.077

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$63.203

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QUARKTWIN TECHNOLOGY LTD

USA . 17,065 parts In-Stock

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Lixinc

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Authorized Procurement Solutions

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Argo Parts USA

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Kepictronics

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 450 parts In-Stock

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Metaverse IC Inc.

Canada . 400 parts In-Stock

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Overview

Unlock endless possibilities with the LM3S1968-IQC50-A2 by Texas Instruments, a top-quality microcontroller designed to elevate your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this device offers unparalleled performance and reliability. Perfect for a wide range of applications, this microcontroller provides value through its advanced features, low power consumption, and high-speed connectivity options. Experience the benefits of seamless integration, precise control, and innovative solutions with the LM3S1968-IQC50-A2. Upgrade your projects and unleash your creativity with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good durability and protection for the microcontroller, making it suitable for various environments.

Integrated Cache: YES

Integrated cache helps in improving the performance of the microcontroller by providing fast access to frequently used data.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation of the microcontroller without the risk of damaging it due to overvoltage.

On Chip Data RAM Width: 8

8-bit width of on-chip data RAM allows for efficient processing and manipulation of data within the microcontroller.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 CPU family ensures that the microcontroller has a powerful and efficient processor for handling complex tasks.

ADC Channels: YES

Availability of ADC channels allows the microcontroller to interface with analog sensors and devices, broadening its range of applications.

Peripherals: PWM(6), QEI(2), TIMER(4), WDT

A wide range of peripherals such as PWM, QEI, TIMER, and WDT provide additional functionalities and capabilities to the microcontroller for diverse applications.

No. of Timers: 4

Having 4 timers enables the microcontroller to manage time-sensitive operations efficiently, enhancing its versatility in various tasks.

RAM Bytes: 65536

With 65536 bytes of RAM, the microcontroller can store and process a significant amount of data, ensuring smooth operation of applications.

Technical Specifications

Microcontrollers LM3S1968-IQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

52

No. of Serial I/Os:

6

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SSI(2), UART(3)

Peripherals:

PWM(6), QEI(2), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

LM3S1968-IQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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