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LM3S6965-IQC50-A2T

Texas Instruments

LM3S6965-IQC50-A2T by Texas Instruments

Texas Instruments' LM3S6965-IQC50-A2T is a 32-bit microcontroller with Cortex-M3 CPU family, featuring 4 ADC channels and 4 timers. It operates at a max clock frequency of 8.192 MHz and has 65536 bytes of RAM, suitable for industrial applications requiring Ethernet connectivity and low power mode.

Median Price

$33.583

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$33.583

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$33.583

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Digiode

USA . 4,075 parts In-Stock

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Vyrian

USA . 2,245 parts In-Stock

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2,245

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Chip Stock

USA . 133 parts In-Stock

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133

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Cyclops Electronics Ltd

UK . 8 parts In-Stock

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8

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Distributors (Availability)

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AZTECH Wire

Italy . 615 parts In-Stock

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$7.212

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$7.212

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One Stop Electronics

USA . 1,163 parts In-Stock

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$10.000

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$10.000

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Corohmni

South Africa . 417 parts In-Stock

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$16.300

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417

$16.300

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Ampacity Inc.

Singapore . 1,502 parts In-Stock

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$24.000

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$24.000

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Continental Prestige Electronics

USA . 32 parts In-Stock

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$33.583

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$32.912

32

$33.583

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$32.912

Parana Technologies

USA . 1,181 parts In-Stock

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$44.793

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ChromeModa Solutions

Germany . 3,523 parts In-Stock

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$50.329

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$41.270

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

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$50.329

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$47.813

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$45.296

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Microchip USA

USA . 2,221 parts In-Stock

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$72.090

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$70.840

1k+ parts

$70.210

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$69.590

2,221

$72.090

$70.840

$70.210

$69.590

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$32.912

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$31.904

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$31.233

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$31.233

DigiPath Technology Company

USA . 1,888 parts In-Stock

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$45.377

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Corphita

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Kepictronics

USA . 266 parts In-Stock

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Perfect Parts

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Argo Parts USA

USA . 208 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the LM3S6965-IQC50-A2T microcontroller. Designed for industrial-grade applications, this powerful device offers a wide range of peripherals and connectivity options, including Ethernet and UART. With low power mode and integrated cache, it ensures efficient performance while saving energy. Trust in Texas Instruments' reputation for quality and innovation to take your projects to the next level with this versatile microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this microcontroller lightweight, durable, and cost-effective.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance and efficiency of the microcontroller by reducing the access time to frequently used data and instructions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making it a preferred choice for modern electronic designs.

Maximum Supply Voltage: 2.75 V

The maximum supply voltage of 2.75 V ensures safe operation and protects the microcontroller from overvoltage situations.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM allows for efficient data processing capabilities within the microcontroller.

Package Shape: SQUARE

The square package shape offers easy mounting and placement on the PCB, optimizing space utilization.

Bit Size: 32

With a 32-bit architecture, this microcontroller can handle complex computations and processing tasks with speed and accuracy.

Power Supplies (V): 2.5,3.3

Supporting multiple power supply voltages of 2.5V and 3.3V, this microcontroller offers flexibility in design and compatibility with various power sources.

No. of Terminals: 100

The 100 terminals provide sufficient I/O interfaces for connectivity with external devices, sensors, and peripherals.

Package Style (Meter): FLATPACK

The flatpack package style offers easy handling, soldering, and reliability in high-density PCB layouts.

Technical Specifications

Microcontrollers LM3S6965-IQC50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

38

No. of Serial I/Os:

7

No. of Terminals:

100

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), SSI, UART(3)

Peripherals:

PWM(6), QEI(2), TIMER(4), WDT

Analog To Digital Convertors:

4-Ch 10-Bit

Trade Compliance

LM3S6965-IQC50-A2T Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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