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LM3S9B96-IQC80-C5T

Texas Instruments

LM3S9B96-IQC80-C5T by Texas Instruments

LM3S9B96-IQC80-C5T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It operates at a max clock frequency of 25 MHz, making it suitable for industrial applications requiring high-speed processing. With features like ADC and DMA channels, this Cortex-M3 CPU family device offers versatile performance in various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 3,496 parts In-Stock

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Digiode

USA . 1,086 parts In-Stock

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Chip Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 808 parts In-Stock

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$8.878

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$8.878

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Ampacity Inc.

Singapore . 201 parts In-Stock

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$9.000

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One Stop Electronics

USA . 685 parts In-Stock

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Parana Technologies

USA . 1,725 parts In-Stock

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DigiPath Technology Company

USA . 1,043 parts In-Stock

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$52.822

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$48.596

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ChromeModa Solutions

Germany . 5,078 parts In-Stock

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$53.900

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$44.198

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IDEA Electronic Components Group

UK . 1,441 parts In-Stock

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$53.900

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$51.205

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$48.510

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Authorized Procurement Solutions

USA . 72,000 parts In-Stock

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Lixinc

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Argo Parts USA

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Corphita

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Microchip USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your projects to the next level with the LM3S9B96-IQC80-C5T microcontroller by Texas Instruments. Renowned for their top-notch quality and cutting-edge technology, Texas Instruments delivers exceptional performance and reliability in every product. This powerful microcontroller is perfect for a wide range of applications, offering unmatched versatility and efficiency. With its advanced features and user-friendly design, the LM3S9B96-IQC80-C5T provides unparalleled value and benefits to customers looking to streamline their projects and achieve outstanding results. Upgrade your creations with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V enables compatibility with a wide range of power sources, enhancing flexibility in system design.

Package Shape: SQUARE

Square package shape facilitates uniform and compact placement on circuit boards, optimizing space utilization and improving overall system aesthetics.

Bit Size: 32

A 32-bit architecture allows for high-performance computing and advanced processing capabilities, making this microcontroller suitable for demanding applications.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) offers compatibility with different components and peripherals, enhancing system integration options.

No. of Terminals: 100

With 100 terminals, this microcontroller provides ample connectivity options for various external devices and components, offering flexibility in system configuration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles enables easy integration into compact electronic devices, suiting space-constrained applications.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures stable operation even under low-power conditions, enhancing overall system reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can perform reliably in industrial environments with elevated temperature conditions.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family ensures efficient processing performance and compatibility with a wide range of software and development tools.

Minimum Operating Temperature: -40 °C

Operational reliability at temperatures as low as -40°C enables use in harsh environmental conditions, expanding the potential applications of this microcontroller.

ADC Channels: YES

Support for ADC channels allows for analog signal conversion, enabling sensor interfacing and data acquisition capabilities in various systems.

DMA Channels: YES

The presence of DMA channels facilitates efficient data transfer and processing, reducing CPU load and enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and assembly processes, improving overall system manufacturability and reliability.

ROM Words: 262144

A ROM capacity of 262144 words provides ample storage for program code and data, accommodating complex algorithms and applications.

Maximum Seated Height: 1.6 mm

With a low seated height of 1.6mm, this microcontroller can be used in slim and compact electronic devices, contributing to a sleek product design.

Width: 14 mm

A width of 14mm enables easy integration into standard PCB layouts, ensuring compatibility with common electronic design practices.

Maximum Clock Frequency: 25 MHz

Operating at a maximum clock frequency of 25MHz, this microcontroller delivers high-speed performance for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds simplifies manufacturing processes and ensures proper soldering of the microcontroller onto PCBs.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C complies with industry standards and ensures reliable soldering during the assembly process, minimizing soldering defects.

Length: 14 mm

A length of 14mm provides a compact form factor, allowing for efficient placement on PCBs and enhancing overall system miniaturization.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this microcontroller is suitable for use in harsh environments and demanding industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Featuring RISC architecture and microcontroller peripheral ICs, this product offers efficient processing capabilities and versatile connectivity options for diverse applications.

RAM Bytes: 98304

With a RAM capacity of 98304 bytes, this microcontroller provides ample memory for storing and processing data, supporting multitasking and complex operations.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing overall system performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures reliable electrical connections, simplifying assembly processes and enhancing product durability.

Maximum Supply Current: 170 mA

Supporting a maximum supply current of 170mA enables stable operation under varying load conditions, ensuring consistent performance in diverse applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and common electronic components, simplifying system integration.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, facilitating motor control, LED dimming, and other voltage modulation applications.

ROM Programmability: FLASH

Flash ROM programmability allows for in-system programming and firmware updates, enhancing flexibility and adaptability in embedded system designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm enables high-density mounting and efficient space utilization on PCBs, accommodating compact and miniaturized electronic devices.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller can withstand standard reflow soldering processes, ensuring component reliability in assembly environments.

Speed: 80 rpm

Operating at a speed of 80rpm, this microcontroller delivers efficient performance for motor control, automation, and other applications requiring precise speed regulation.

No. of I/O Lines: 65

Featuring 65 I/O lines, this microcontroller offers versatile interfacing options for connecting to sensors, actuators, displays, and other external devices in complex systems.

Technical Specifications

Microcontrollers LM3S9B96-IQC80-C5T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B96-IQC80-C5T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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