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LM3S6965-IBZ50-A2T

Texas Instruments

LM3S6965-IBZ50-A2T by Texas Instruments

LM3S6965-IBZ50-A2T by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 65536 RAM bytes. It operates at a max clock frequency of 8.192 MHz, making it suitable for industrial applications requiring high-speed processing and control capabilities. With 42 I/O lines and PWM channels, this microcontroller offers versatile connectivity options for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,000 parts In-Stock

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6,000

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Digiode

USA . 1,445 parts In-Stock

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1,445

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Distributors (Availability)

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Semicontronic

India . 1,021 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

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1,021

$9.000

$8.775

$8.730

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AZTECH Wire

Italy . 596 parts In-Stock

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$11.883

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596

$11.883

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Ampacity Inc.

Singapore . 1,420 parts In-Stock

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$18.000

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$18.000

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Parana Technologies

USA . 1,903 parts In-Stock

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$18.755

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$18.844

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1,903

$18.755

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$18.844

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One Stop Electronics

USA . 968 parts In-Stock

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$19.000

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968

$19.000

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DigiPath Technology Company

USA . 2,202 parts In-Stock

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$20.652

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$18.999

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$20.652

$18.999

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ChromeModa Solutions

Germany . 2,278 parts In-Stock

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$21.073

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$17.280

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$21.073

$17.280

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IDEA Electronic Components Group

UK . 225 parts In-Stock

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$21.073

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$20.019

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$18.966

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225

$21.073

$20.019

$18.966

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Corohmni

South Africa . 233 parts In-Stock

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$23.634

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233

$23.634

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$25.871

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$24.577

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$24.577

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$25.871

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$24.577

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Continental Prestige Electronics

USA . 6,452 parts In-Stock

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Corphita

USA . 4,848 parts In-Stock

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Argo Parts USA

USA . 1,446 parts In-Stock

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1,446

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Microchip USA

USA . 241 parts In-Stock

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241

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the LM3S6965-IBZ50-A2T microcontroller by Texas Instruments. Crafted with precision and expertise, this marvel of technology offers unparalleled performance and reliability. From industrial automation to consumer electronics, this device empowers you to bring your ideas to life with ease. Experience seamless integration, superior power efficiency, and cutting-edge features that set you apart from the competition. Elevate your projects to new heights with the LM3S6965-IBZ50-A2T and witness innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Surface mount installation allows for easy and space-saving integration into circuits or devices.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage helps in reducing power consumption and heat generation.

Package Shape: SQUARE

Square shape makes it easier to handle and place the product on a circuit board.

Bit Size: 32

Large bit size enables processing of complex algorithms and tasks efficiently.

Power Supplies (V): 2.5,3.3

Dual power supply options provide flexibility in different application scenarios.

No. of Terminals: 108

Having a high number of terminals allows for connection to multiple components, expanding functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved signal integrity and thermal performance.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, the product can operate efficiently even in low power situations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with TIN SILVER COPPER provides excellent conductivity and corrosion resistance.

ADC Channels: YES

Having ADC channels allows for analog signal processing and conversion, expanding application possibilities.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and assembly.

ROM Words: 262144

Large ROM capacity allows for storing a significant amount of program data for complex applications.

Maximum Seated Height: 1.5 mm

Low seated height saves space and enables compact designs.

Width: 10 mm

Narrow width allows for space-efficient placement on a PCB.

Maximum Clock Frequency: 8.192 MHz

High clock frequency enables fast processing and operation speed.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering and reliability during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures robust solder joints and product longevity.

Length: 10 mm

Compact length allows for efficient use of space on a PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture provides efficient processing capabilities for various applications.

RAM Bytes: 65536

Large RAM capacity allows for storing and accessing multiple data quickly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and connection to the PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability.

PWM Channels: YES

PWM channels enable precise control of digital signals for applications like motor control and power management.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updates to the program code.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density PCB designs and connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand standard moisture exposure during storage and handling.

Speed: 50 rpm

Speed rating of 50 rpm indicates high operational speed and performance capabilities.

No. of I/O Lines: 42

Having 42 I/O lines allows for versatile input and output capabilities, enhancing product functionality.

Technical Specifications

Microcontrollers LM3S6965-IBZ50-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

8.192 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

65536

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S6965-IBZ50-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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