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LM3S9B96-IQC80-C5

Texas Instruments

LM3S9B96-IQC80-C5 by Texas Instruments

LM3S9B96-IQC80-C5 by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 25 MHz. It has 262144 ROM words and 98304 bytes of RAM, making it suitable for industrial applications requiring high-speed processing and ample memory. With its PWM channels and ADC channels, it can be used in various control systems.

Median Price

$461.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 70 parts In-Stock

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$461.540

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$346.150

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$300.000

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70

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Vyrian

USA . 2,599 parts In-Stock

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Digiode

USA . 2,439 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Chip Stock

USA . 958 parts In-Stock

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One Stop Electronics

USA . 320 parts In-Stock

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$6.000

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320

$6.000

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Ampacity Inc.

Singapore . 827 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 249 parts In-Stock

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$12.930

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Corohmni

South Africa . 17 parts In-Stock

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$21.040

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$21.040

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Parana Technologies

USA . 1,067 parts In-Stock

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$32.815

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$112.927

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1,067

$32.815

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DigiPath Technology Company

USA . 731 parts In-Stock

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$36.134

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$33.243

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731

$36.134

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ChromeModa Solutions

Germany . 6,549 parts In-Stock

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$36.871

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$30.234

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$36.871

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IDEA Electronic Components Group

UK . 891 parts In-Stock

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$36.871

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$35.027

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$33.184

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891

$36.871

$35.027

$33.184

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Modulus Dynamics

Lithuania . 2,752 parts In-Stock

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$59.861

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$59.861

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$59.861

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Perfect Parts

USA . 8,130 parts In-Stock

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Argo Parts USA

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Lixinc

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Alle Elektronik GmbH

Germany . 1,053 parts In-Stock

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Kepictronics

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Corphita

USA . 455 parts In-Stock

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Continental Prestige Electronics

USA . 452 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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A-Z Elektronik GmbH

Germany . 218 parts In-Stock

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Microchip USA

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iodParts Technologies Inc.

India . 150 parts In-Stock

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Overview

Looking to enhance your electronic projects? Look no further than the LM3S9B96-IQC80-C5 microcontroller by Texas Instruments. With its top-notch quality and cutting-edge technology, this microcontroller is a game-changer in the industry. Whether you're designing IoT devices, robotics, or industrial applications, this product offers unmatched value, benefits, and advantages. Its powerful Cortex-M3 CPU family ensures superior performance, while its extensive ROM programming capabilities allow for flexibility and customization. Plus, with features like ADC and DMA channels, PWM channels, and a wide range of I/O lines, the possibilities are endless. Get ready to take your projects to new heights with the LM3S9B96-IQC80-C5!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the microcontroller reliable for long-term use in various applications.

Surface Mount: YES

Surface mount technology allows for easier assembly on PCBs and saves space, making the microcontroller suitable for compact designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the microcontroller can handle higher voltage levels without getting damaged, increasing its versatility.

Bit Size: 32

32-bit architecture provides enhanced performance and efficiency compared to lower bit sizes, making the microcontroller suitable for complex tasks and calculations.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages (1.2V and 3.3V) allows for flexible power options, catering to different system requirements.

No. of Terminals: 100

Having 100 terminals enables connectivity with various external components and peripherals, expanding the microcontroller's functionality.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and energy efficiency, making the microcontroller ideal for power-sensitive applications.

Maximum Operating Temperature: 85 °C

The microcontroller can operate efficiently in high-temperature environments up to 85 °C, ensuring reliability in industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the microcontroller is suitable for use in harsh environments or extreme weather conditions.

ADC Channels: YES

Analog-to-digital converter channels allow the microcontroller to interface with analog sensors and devices, enabling real-world data acquisition and processing.

DMA Channels: YES

Direct memory access channels improve data transfer speed and efficiency, enhancing performance in applications requiring high-speed data processing.

ROM Words: 262144

Having 262144 ROM words provides ample storage for program code and firmware, enabling the microcontroller to handle complex applications and algorithms.

RAM Bytes: 98304

The microcontroller's 98304 bytes of RAM allow for efficient data storage and manipulation, facilitating multitasking and memory-intensive operations.

Technical Specifications

Microcontrollers LM3S9B96-IQC80-C5 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

65

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

170 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S9B96-IQC80-C5 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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