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F28M36P53C2ZWTQ

Texas Instruments

F28M36P53C2ZWTQ by Texas Instruments

The Texas Instruments F28M36P53C2ZWTQ microcontroller features a peak reflow temperature of 260°C and a max time at peak reflow temperature of 30s. This RISC-based CMOS technology device is ideal for various applications requiring a high-performance microcontroller with TIN SILVER COPPER terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,740 parts In-Stock

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Digiode

USA . 1,135 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 247 parts In-Stock

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$10.498

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247

$10.498

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One Stop Electronics

USA . 966 parts In-Stock

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$16.000

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966

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Parana Technologies

USA . 2,341 parts In-Stock

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$71.805

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$6,668.202

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$64.625

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2,341

$71.805

$6,668.202

$64.625

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DigiPath Technology Company

USA . 716 parts In-Stock

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$79.066

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$72.741

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716

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ChromeModa Solutions

Germany . 1,741 parts In-Stock

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$80.680

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$66.158

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$80.680

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

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$80.680

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$76.646

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$72.612

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1,574

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$72.612

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Northwest PG Solutions

USA . 1,419 parts In-Stock

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Corphita

USA . 1,084 parts In-Stock

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Native Components

USA . 989 parts In-Stock

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Microchip USA

USA . 342 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the F28M36P53C2ZWTQ Microcontroller. This cutting-edge device offers superior performance and versatility, making it ideal for a wide range of applications. From IoT devices to industrial automation, this microcontroller delivers exceptional value and benefits to customers looking for advanced functionality and efficiency. Trust Texas Instruments to provide the best-in-class solutions for your next project.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, making the product reliable in various environments.

Terminal Finish: SILVER

Silver terminal finish offers high electrical conductivity, ensuring efficient performance of the microcontroller.

Terminal Finish: COPPER

Copper terminal finish provides excellent thermal conductivity, aiding in heat dissipation and overall reliability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the product can undergo reflow soldering quickly and efficiently, saving time during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering of the microcontroller, leading to reliable connections and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller allows for high-speed processing and efficient use of resources, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Moisture Sensitivity Level (MSL): 3

With MSL 3 rating, the microcontroller can withstand moderate humidity levels during storage and handling, ensuring its reliability and longevity.

Technical Specifications

Microcontrollers F28M36P53C2ZWTQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36P53C2ZWTQ Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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