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F28M35M22C1RFPT

Texas Instruments

F28M35M22C1RFPT by Texas Instruments

Texas Instruments F28M35M22C1RFPT microcontroller features 32-bit CPU, 6-Ch 10-Bit DAC, and 10-Ch 12-Bit ADC. Ideal for industrial applications requiring high-speed processing, with peripherals like CRC, DMA(38), PWM, TIMER(8), WDT(2). Operates at -40 to 105 °C temperature range.

Median Price

$12.815

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,547 parts In-Stock

1+ parts

$12.815

100+ parts

$11.194

1k+ parts

$7.720

10k+ parts

-

1,547

$12.815

$11.194

$7.720

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 167 parts In-Stock

1+ parts

$12.174

100+ parts

-

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167

$12.174

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Vyrian

USA . 7,455 parts In-Stock

1+ parts

-

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7,455

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,516 parts In-Stock

1+ parts

$10.890

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-

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1,516

$10.890

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Corphita

USA . 428 parts In-Stock

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$11.534

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428

$11.534

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AZTECH Wire

Italy . 614 parts In-Stock

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$14.190

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614

$14.190

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Parana Technologies

USA . 1,327 parts In-Stock

1+ parts

$29.105

100+ parts

-

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$55.478

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-

1,327

$29.105

-

$55.478

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DigiPath Technology Company

USA . 1,002 parts In-Stock

1+ parts

$32.048

100+ parts

$29.484

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1,002

$32.048

$29.484

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ChromeModa Solutions

Germany . 4,162 parts In-Stock

1+ parts

$32.702

100+ parts

$26.816

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4,162

$32.702

$26.816

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IDEA Electronic Components Group

UK . 798 parts In-Stock

1+ parts

$32.702

100+ parts

$31.067

1k+ parts

$29.432

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798

$32.702

$31.067

$29.432

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Epart123

USA . 7,080 parts In-Stock

1+ parts

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$8.900

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7,080

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$8.900

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Northwest PG Solutions

USA . 1,308 parts In-Stock

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1,308

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Component Stockers USA

USA . 1,163 parts In-Stock

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Native Components

USA . 776 parts In-Stock

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776

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the F28M35M22C1RFPT microcontroller. This versatile device offers a wide range of applications in various industries, providing exceptional performance and efficiency. With its advanced features and cutting-edge technology, this microcontroller delivers unparalleled value and benefits to customers looking for a top-tier solution. Trust Texas Instruments for all your microcontroller needs and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and flexibility in design, making the product suitable for a variety of applications.

Maximum Supply Voltage: 1.26 V

Allows for efficient power usage and helps prevent damage to the microcontroller.

Bit Size: 32

High bit size allows for complex calculations and operations, making the microcontroller versatile.

ADC Channels: YES

Ability to input analog signals for processing, enhancing the functionality of the microcontroller.

DMA Channels: YES

Direct Memory Access channels improve data transfer speed and efficiency, optimizing overall performance.

Technical Specifications

Microcontrollers F28M35M22C1RFPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

75 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

38

No. of External Interrupts:

3

No. of I/O Lines:

74

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

RAM Words:

136

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

150 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), CAN(2), SCI, SSI(4), SPI(5), UART(5), USB,"

Peripherals:

"CRC, DMA(38), PWM,TIMER(8), WDT(2)"

Analog To Digital Convertors:

10-Ch 12-Bit(2)

Digital To Analog Convertors:

6-Ch 10-Bit

Trade Compliance

F28M35M22C1RFPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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