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F28M35M20B1RFPS

Texas Instruments

F28M35M20B1RFPS by Texas Instruments

The Texas Instruments F28M35M20B1RFPS microcontroller features a 32-bit CPU, 144 terminals, and 73728 bytes of RAM. Ideal for automotive applications with operating temperatures ranging from -40 to 125°C. Suitable for surface mount assembly with a package style of flatpack.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,243 parts In-Stock

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3,243

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Digiode

USA . 2,126 parts In-Stock

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2,126

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Distributors (Availability)

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Native Components

USA . 356 parts In-Stock

1+ parts

$0.137

100+ parts

-

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$0.131

356

$0.137

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$0.131

Northwest PG Solutions

USA . 1,127 parts In-Stock

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$0.150

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-

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$0.132

1,127

$0.150

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$0.132

AZTECH Wire

Italy . 590 parts In-Stock

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$11.448

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590

$11.448

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One Stop Electronics

USA . 1,276 parts In-Stock

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$18.000

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1,276

$18.000

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Parana Technologies

USA . 1,708 parts In-Stock

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$42.667

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1,708

$42.667

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$46.981

100+ parts

$43.223

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786

$46.981

$43.223

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IDEA Electronic Components Group

UK . 1,595 parts In-Stock

1+ parts

$47.940

100+ parts

$45.543

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$43.146

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1,595

$47.940

$45.543

$43.146

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ChromeModa Solutions

Germany . 742 parts In-Stock

1+ parts

$47.940

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$39.311

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742

$47.940

$39.311

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Corphita

USA . 4,550 parts In-Stock

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4,550

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Microchip USA

USA . 438 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with Texas Instruments' F28M35M20B1RFPS microcontroller. Designed for automotive applications, this microcontroller offers exceptional performance and reliability. With a 32-bit CPU family and 65536 ROM words, this device ensures seamless operation in extreme conditions. The package body material, PLASTIC/EPOXY, makes it durable and long-lasting. Bring your projects to life with the precision and efficiency of the F28M35M20B1RFPS microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto PCBs, saving time and cost during production.

Bit Size: 32

32-bit architecture provides higher processing power and efficiency, making the microcontroller suitable for handling complex tasks.

Power Supplies (V): 1.2,1.8,3.3

Support for multiple power supply options offers flexibility in system design and compatibility with various voltage requirements.

No. of Terminals: 144

Having 144 terminals allows for more connectivity options and peripherals to be integrated, enhancing the functionality of the microcontroller.

CPU Family: CORTEX-M3

Utilizing the Cortex-M3 CPU family ensures high performance and efficiency in processing and operating the microcontroller.

ROM Words: 65536

With a ROM capacity of 65536 words, the microcontroller can store a large amount of program data and instructions for execution.

RAM Bytes: 73728

Having 73728 bytes of RAM allows for efficient data storage and manipulation during operation, improving overall performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller with various peripheral IC types ensures compatibility with different devices and applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Technical Specifications

Microcontrollers F28M35M20B1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

CORTEX-M3

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

73728

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

150 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M35M20B1RFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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