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F28M35H22C1RFPS

Texas Instruments

F28M35H22C1RFPS by Texas Instruments

The Texas Instruments F28M35H22C1RFPS microcontroller features a 32-bit CPU, 6-Ch 10-Bit DAC, and 10-Ch 12-Bit ADC for automotive applications. With a max clock frequency of 20 MHz, it offers low power mode and connectivity options like I2C, CAN, and USB. This CMOS technology device has a terminal pitch of 0.5 mm and operates in temperatures ranging from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,440 parts In-Stock

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4,440

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Digiode

USA . 3,678 parts In-Stock

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3,678

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Distributors (Availability)

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Native Components

USA . 470 parts In-Stock

1+ parts

$0.111

100+ parts

-

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$0.107

470

$0.111

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$0.107

Northwest PG Solutions

USA . 1,480 parts In-Stock

1+ parts

$0.122

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-

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$0.108

1,480

$0.122

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$0.108

AZTECH Wire

Italy . 672 parts In-Stock

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$11.504

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672

$11.504

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One Stop Electronics

USA . 1,517 parts In-Stock

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$20.000

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1,517

$20.000

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Parana Technologies

USA . 2,172 parts In-Stock

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$66.898

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2,172

$66.898

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IDEA Electronic Components Group

UK . 1,939 parts In-Stock

1+ parts

$75.166

100+ parts

$71.408

1k+ parts

$67.649

10k+ parts

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1,939

$75.166

$71.408

$67.649

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ChromeModa Solutions

Germany . 1,055 parts In-Stock

1+ parts

$75.166

100+ parts

$61.636

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1,055

$75.166

$61.636

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Corphita

USA . 3,833 parts In-Stock

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3,833

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DigiPath Technology Company

USA . 1,136 parts In-Stock

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$67.770

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1,136

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$67.770

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Overview

Experience the cutting-edge technology of Texas Instruments with the F28M35H22C1RFPS microcontroller, designed for high-performance applications. This sleek square package boasts a range of features, including 32-bit processing power and multiple ADC and DAC channels for optimal functionality. Perfect for automotive-grade projects, this microcontroller offers low power modes and a wide variety of peripherals such as PWM, timers, and connectivity options like CAN and USB. Trust in Texas Instruments' reputation for quality and innovation, and unlock endless possibilities with the F28M35H22C1RFPS microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation and integration of the microcontroller onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy-efficient.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high performance and energy efficiency, making it ideal for embedded applications.

ADC Channels: YES

The presence of Analog to Digital Convertors allows the microcontroller to interface with analog sensors and devices, expanding its application capabilities.

ROM Programmability: FLASH

Flash programmable ROM enables easy and quick updates to the microcontroller's firmware, enhancing flexibility and adaptability for different use cases.

No. of Timers: 8

Having multiple timers allows for precise timing control in various applications such as PWM generation, event counting, and scheduling tasks.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides high performance and efficiency by simplifying instruction execution, making it suitable for real-time processing tasks.

Technical Specifications

Microcontrollers F28M35H22C1RFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

38

No. of External Interrupts:

3

No. of I/O Lines:

74

No. of Serial I/Os:

7

No. of Terminals:

144

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP144,.9SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

139264

RAM Words:

136

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C(2), CAN(2), SCI, SSI(4), SPI(5), UART(5), USB,"

Peripherals:

"CRC, DMA(38), PWM,TIMER(8), WDT(2)"

Analog To Digital Convertors:

10-Ch 12-Bit(2)

Digital To Analog Convertors:

6-Ch 10-Bit

Trade Compliance

F28M35H22C1RFPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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