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CC430F6145IRGCT

Texas Instruments

CC430F6145IRGCT by Texas Instruments

CC430F6145IRGCT by Texas Instruments is a 16-bit microprocessor with 2/3.3V power supplies, 16384 ROM words, and 2048 RAM bytes. It operates in industrial temperatures from -40 to 85°C and is ideal for applications requiring a MICROPROCESSOR CIRCUIT in a compact CHIP CARRIER package with very thin profile.

Median Price

$3.920

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,250 parts In-Stock

1+ parts

$3.920

100+ parts

$3.840

1k+ parts

$3.760

10k+ parts

-

3,250

$3.920

$3.840

$3.760

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,591

-

-

-

-

Digiode

USA . 2,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,797

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 723 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

$0.180

723

$0.188

-

-

$0.180

Northwest PG Solutions

USA . 1,883 parts In-Stock

1+ parts

$0.207

100+ parts

-

1k+ parts

-

10k+ parts

$0.182

1,883

$0.207

-

-

$0.182

Parana Technologies

USA . 805 parts In-Stock

1+ parts

$16.894

100+ parts

-

1k+ parts

$17.133

10k+ parts

-

805

$16.894

-

$17.133

-

AZTECH Wire

Italy . 871 parts In-Stock

1+ parts

$17.060

100+ parts

-

1k+ parts

-

10k+ parts

-

871

$17.060

-

-

-

DigiPath Technology Company

USA . 881 parts In-Stock

1+ parts

$18.602

100+ parts

$17.114

1k+ parts

-

10k+ parts

-

881

$18.602

$17.114

-

-

ChromeModa Solutions

Germany . 5,322 parts In-Stock

1+ parts

$18.982

100+ parts

$15.565

1k+ parts

-

10k+ parts

-

5,322

$18.982

$15.565

-

-

IDEA Electronic Components Group

UK . 166 parts In-Stock

1+ parts

$18.982

100+ parts

$18.033

1k+ parts

$17.084

10k+ parts

-

166

$18.982

$18.033

$17.084

-

One Stop Electronics

USA . 419 parts In-Stock

1+ parts

$21.000

100+ parts

-

1k+ parts

-

10k+ parts

-

419

$21.000

-

-

-

Corohmni

South Africa . 2,743 parts In-Stock

1+ parts

$75.903

100+ parts

-

1k+ parts

-

10k+ parts

-

2,743

$75.903

-

-

-

Corphita

USA . 4,477 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,477

-

-

-

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Overview

Elevate your projects with the CC430F6145IRGCT by Texas Instruments, a high-quality microprocessor circuit designed for a wide range of applications. With a powerful MSP430 CPU family and advanced CMOS technology, this chip offers unmatched performance and reliability. Whether you're working on industrial automation, IoT devices, or wearable tech, this IC delivers exceptional value and efficiency. Trust in Texas Instruments' reputation for excellence and innovation, and unlock the full potential of your designs with the CC430F6145IRGCT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the integrated circuits inside, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Can handle higher voltages, providing flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Optimizes space utilization and allows for efficient placement on circuit boards.

Bit Size: 16

Offers sufficient processing power and capability for a wide range of applications.

Power Supplies (V): 2/3.3

Supports multiple power supply options, enabling compatibility with different systems and configurations.

No. of Terminals: 64

Provides ample connectivity for interfacing with other components in a system, enhancing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers various mounting options for different applications and environments, allowing for customization and optimization of performance.

Minimum Supply Voltage: 2.4 V

Supports lower voltage operation, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial and harsh environments.

CPU Family: MSP430

Comes from a reliable and proven family of microcontrollers, ensuring quality and performance.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions, suitable for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and reliable electrical connections, ensuring long-term performance.

Terminal Position: QUAD

Facilitates easy and secure mounting onto circuit boards, enhancing reliability during operation.

ROM Words: 16384

Offers ample storage for program and data storage, enabling diverse applications and functionalities.

Maximum Seated Height: 1 mm

Compact size allows for space-efficient designs and integration into small form factor devices.

Width: 9 mm

Compact width allows for flexibility in board layout and component placement.

Maximum Time At Peak Reflow Temperature (s): 30

Supports efficient and reliable soldering processes during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures, ensuring proper soldering and assembly.

Length: 9 mm

Compact length enables space-saving designs and integration into small devices.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial environments with high reliability and durability.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Includes integrated peripheral circuits for enhanced functionality and application support.

RAM Bytes: 2048

Sufficient RAM size for data processing and temporary storage, enabling efficient operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance, suitable for various applications.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and provide reliable connections.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent and reliable operation in various applications.

ROM Programmability: FLASH

Allows for reprogramming of the ROM, enabling flexibility and versatility in applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact designs and high-density integration on circuit boards.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes and storage in moderate humidity environments.

Speed: 20 rpm

Provides fast processing speed for quick response times in real-time applications.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CC430F6145IRGCT attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES IN 1.8V MINIMUM SUPPLY

Bit Size:

16

CPU Family:

MSP430

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

CC430F6145IRGCT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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