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BQ4010YMA-70

Texas Instruments

BQ4010YMA-70 by Texas Instruments

BQ4010YMA-70 by Texas Instruments is an 8Kx8 SRAM module with a memory density of 65536 bits. It operates at a nominal voltage of 5V and has a max access time of 70ns. This non-volatile memory IC is commonly used in commercial applications requiring fast and reliable data storage.

Median Price

$13.180

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35 parts In-Stock

1+ parts

$11.170

100+ parts

$10.950

1k+ parts

$10.720

10k+ parts

-

35

$11.170

$10.950

$10.720

-

DigiKey

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$13.180

1k+ parts

-

10k+ parts

-

35

-

$13.180

-

-

Verical

USA . 35 parts In-Stock

1+ parts

-

100+ parts

$14.213

1k+ parts

$12.713

10k+ parts

$11.975

35

-

$14.213

$12.713

$11.975

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,488 parts In-Stock

1+ parts

$12.036

100+ parts

-

1k+ parts

-

10k+ parts

-

1,488

$12.036

-

-

-

Vyrian

USA . 8,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,705

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-

-

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Bristol Electronics

USA . 256 parts In-Stock

1+ parts

-

100+ parts

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256

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Atlantic Semiconductor

USA . 256 parts In-Stock

1+ parts

-

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256

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Semi Source

USA . 14 parts In-Stock

1+ parts

-

100+ parts

-

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14

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Mentor Electronics Marketing, LLC

USA . 6 parts In-Stock

1+ parts

-

100+ parts

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6

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 858 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

$0.262

858

$0.273

-

-

$0.262

Northwest PG Solutions

USA . 2,079 parts In-Stock

1+ parts

$0.301

100+ parts

-

1k+ parts

-

10k+ parts

$0.265

2,079

$0.301

-

-

$0.265

Parana Technologies

USA . 619 parts In-Stock

1+ parts

$3.282

100+ parts

-

1k+ parts

$3.806

10k+ parts

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619

$3.282

-

$3.806

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DigiPath Technology Company

USA . 765 parts In-Stock

1+ parts

$3.614

100+ parts

$3.325

1k+ parts

-

10k+ parts

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765

$3.614

$3.325

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ChromeModa Solutions

Germany . 3,599 parts In-Stock

1+ parts

$3.688

100+ parts

$3.024

1k+ parts

-

10k+ parts

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3,599

$3.688

$3.024

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IDEA Electronic Components Group

UK . 883 parts In-Stock

1+ parts

$3.688

100+ parts

-

1k+ parts

$3.319

10k+ parts

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883

$3.688

-

$3.319

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Ampacity Inc.

Singapore . 35 parts In-Stock

1+ parts

$10.770

100+ parts

-

1k+ parts

-

10k+ parts

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35

$10.770

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-

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Corphita

USA . 355 parts In-Stock

1+ parts

$11.403

100+ parts

-

1k+ parts

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10k+ parts

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355

$11.403

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-

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Microchip USA

USA . 147 parts In-Stock

1+ parts

$34.050

100+ parts

$33.560

1k+ parts

$33.320

10k+ parts

$33.080

147

$34.050

$33.560

$33.320

$33.080

Overview

Experience top-notch performance and reliability with the BQ4010YMA-70 from Texas Instruments. As a leader in the industry, Texas Instruments ensures that their SRAM products meet the highest quality standards. Ideal for a wide range of applications, this non-volatile SRAM module offers customers exceptional value and benefits. Whether you need fast access times or low standby currents, the BQ4010YMA-70 delivers on all fronts, making it the perfect choice for your memory IC needs.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various electronic systems and circuits.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in timing and data transfer, making it suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies commonly used in electronic devices.

Organization: 8KX8

Organized as 8Kx8, providing a good balance between storage capacity and access speed for various data processing needs.

Temperature Grade: COMMERCIAL

Suitable for use in commercial applications within the specified temperature range, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Memory IC Type: NON-VOLATILE SRAM MODULE

Being non-volatile, the SRAM module retains data even when power is removed, ensuring data integrity and reliability.

Technical Specifications

SRAM BQ4010YMA-70 attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

Maximum Access Time:

70 ns

JESD-30 Code:

R-XDMA-T28

Length:

37.72 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

9.53 mm

Maximum Standby Current:

.004 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

75 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18.415 mm

Trade Compliance

BQ4010YMA-70 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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