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BQ4010MA-200

Texas Instruments

BQ4010MA-200 by Texas Instruments

BQ4010MA-200 by Texas Instruments is an 8Kx8 non-volatile SRAM module with a memory density of 65536 bits. It operates at a nominal voltage of 5V and has a max access time of 200ns. Ideal for applications requiring fast, reliable data storage in commercial temperature environments.

Median Price

$17.570

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

$15.200

1k+ parts

$13.600

10k+ parts

$12.800

2,342

-

$15.200

$13.600

$12.800

DigiKey

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

$17.570

1k+ parts

-

10k+ parts

-

2,342

-

$17.570

-

-

Verical

USA . 2,340 parts In-Stock

1+ parts

-

100+ parts

$19.000

1k+ parts

$17.000

10k+ parts

$16.000

2,340

-

$19.000

$17.000

$16.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 313 parts In-Stock

1+ parts

$13.910

100+ parts

$14.605

1k+ parts

$13.771

10k+ parts

-

313

$13.910

$14.605

$13.771

-

Digiode

USA . 733 parts In-Stock

1+ parts

$16.046

100+ parts

-

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-

10k+ parts

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733

$16.046

-

-

-

Vyrian

USA . 2,949 parts In-Stock

1+ parts

$16.890

100+ parts

-

1k+ parts

-

10k+ parts

-

2,949

$16.890

-

-

-

DigiKey Marketplace

USA . 2,342 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,342

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-

-

-

Electronic Expediters

USA . 347 parts In-Stock

1+ parts

-

100+ parts

-

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347

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Prism Electronics

USA . 84 parts In-Stock

1+ parts

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84

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,560 parts In-Stock

1+ parts

$3.338

100+ parts

-

1k+ parts

$3.862

10k+ parts

-

1,560

$3.338

-

$3.862

-

DigiPath Technology Company

USA . 1,801 parts In-Stock

1+ parts

$3.676

100+ parts

-

1k+ parts

-

10k+ parts

-

1,801

$3.676

-

-

-

ChromeModa Solutions

Germany . 2,600 parts In-Stock

1+ parts

$3.751

100+ parts

$3.076

1k+ parts

-

10k+ parts

-

2,600

$3.751

$3.076

-

-

IDEA Electronic Components Group

UK . 942 parts In-Stock

1+ parts

$3.751

100+ parts

-

1k+ parts

$3.376

10k+ parts

-

942

$3.751

-

$3.376

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Ampacity Inc.

Singapore . 2,067 parts In-Stock

1+ parts

$14.360

100+ parts

-

1k+ parts

-

10k+ parts

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2,067

$14.360

-

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Corphita

USA . 3,887 parts In-Stock

1+ parts

$15.201

100+ parts

-

1k+ parts

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10k+ parts

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3,887

$15.201

-

-

-

Native Components

USA . 755 parts In-Stock

1+ parts

$202.734

100+ parts

-

1k+ parts

-

10k+ parts

$194.625

755

$202.734

-

-

$194.625

Northwest PG Solutions

USA . 575 parts In-Stock

1+ parts

$223.007

100+ parts

-

1k+ parts

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575

$223.007

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-

-

Microchip USA

USA . 236 parts In-Stock

1+ parts

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236

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Perfect Parts

USA . 94 parts In-Stock

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94

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Overview

Enhance your electronic designs with the BQ4010MA-200 by Texas Instruments, a high-quality SRAM module that offers outstanding performance and reliability. Manufactured by industry leader Texas Instruments, this non-volatile memory IC boasts a wide range of applications in various electronic devices. With its low power consumption and fast access time, the BQ4010MA-200 provides exceptional value and benefits to customers looking for dependable memory solutions. Upgrade your projects with this versatile and efficient product today.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle, making the product convenient for installation and integration into various systems.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent access to each memory location, providing flexibility and efficient data retrieval.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems and simplifies power management.

Memory IC Type: NON-VOLATILE SRAM MODULE

Being non-volatile ensures that data is retained even when power is disconnected, making it suitable for applications where data integrity is crucial.

Maximum Access Time: 200 ns

Fast access time ensures quick data retrieval, making the product ideal for high-performance applications where speed is essential.

Technical Specifications

SRAM BQ4010MA-200 attributes and parameters. Explore more SRAM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-XDMA-T28

Length:

37.72 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

9.53 mm

Maximum Standby Current:

.004 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

75 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

18.415 mm

Trade Compliance

BQ4010MA-200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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