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CY62167EV18LL-55BVXI

Infineon Technologies

CY62167EV18LL-55BVXI by Infineon Technologies

CY62167EV18LL-55BVXI by Infineon: 1MX16 SRAM with 55ns access time, operates at 1.8V, and has 3-STATE output. Ideal for industrial applications requiring high-speed memory with low standby current. Package style is grid array, very thin profile, fine pitch.

Median Price

$15.160

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,891 parts In-Stock

1+ parts

$12.130

100+ parts

$9.460

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$12.130

$9.460

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Newark

USA . 213 parts In-Stock

1+ parts

$14.840

100+ parts

$11.330

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$10.650

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213

$14.840

$11.330

$10.650

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Arrow

USA . 960 parts In-Stock

1+ parts

$15.479

100+ parts

$13.251

1k+ parts

$12.510

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960

$15.479

$13.251

$12.510

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DigiKey

USA . 669 parts In-Stock

1+ parts

$15.510

100+ parts

$13.277

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$12.535

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669

$15.510

$13.277

$12.535

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Mouser Electronics

USA . 1,628 parts In-Stock

1+ parts

$17.240

100+ parts

$14.770

1k+ parts

$13.930

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1,628

$17.240

$14.770

$13.930

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Element14

Singapore . 1,891 parts In-Stock

1+ parts

$1,100.070

100+ parts

$953.930

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$953.930

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Flip Electronics (Authorized)

USA . 7,708 parts In-Stock

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Rochester

USA . 7,678 parts In-Stock

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$9.350

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$8.360

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$7.870

7,678

-

$9.350

$8.360

$7.870

Verical

USA . 3,787 parts In-Stock

1+ parts

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100+ parts

$11.688

1k+ parts

$10.450

10k+ parts

$9.838

3,787

-

$11.688

$10.450

$9.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 207 parts In-Stock

1+ parts

$10.478

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207

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Flip Electronics

USA . 4,331 parts In-Stock

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Chip Stock

USA . 3,900 parts In-Stock

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Vyrian

USA . 2,887 parts In-Stock

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Inventory MP

USA . 1,038 parts In-Stock

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1,038

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Bristol Electronics

USA . 1,038 parts In-Stock

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Zilex Electronics Inc.

Canada . 368 parts In-Stock

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368

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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Nova Conductors

Japan . 96 parts In-Stock

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Prism Electronics

USA . 11 parts In-Stock

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11

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Resion

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 2,745 parts In-Stock

1+ parts

$3.562

100+ parts

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2,745

$3.562

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Modulus Dynamics

Lithuania . 4,512 parts In-Stock

1+ parts

$5.051

100+ parts

$4.849

1k+ parts

$4.647

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4,512

$5.051

$4.849

$4.647

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Corohmni

South Africa . 147 parts In-Stock

1+ parts

$5.591

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147

$5.591

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Ampacity Inc.

Singapore . 2,664 parts In-Stock

1+ parts

$8.860

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2,664

$8.860

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Semicontronic

India . 2,551 parts In-Stock

1+ parts

$8.860

100+ parts

$8.638

1k+ parts

$8.594

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2,551

$8.860

$8.638

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Corphita

USA . 311 parts In-Stock

1+ parts

$9.927

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311

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Continental Prestige Electronics

USA . 2,392 parts In-Stock

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$10.170

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Component Stockers USA

USA . 3,160 parts In-Stock

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$11.190

100+ parts

$11.200

1k+ parts

$9.930

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3,160

$11.190

$11.200

$9.930

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A-Z Elektronik GmbH

Germany . 7,239 parts In-Stock

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Lixinc

USA . 6,204 parts In-Stock

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Futuretech Components

Singapore . 6,177 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,826 parts In-Stock

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Perfect Parts

USA . 1,651 parts In-Stock

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Argo Parts USA

USA . 836 parts In-Stock

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Infinite Electronics LLP (Excess)

. 359 parts In-Stock

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359

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Kepictronics

USA . 327 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 40 parts In-Stock

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iodParts Technologies Inc.

India . 16 parts In-Stock

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Overview

Unlock the power of reliable data storage with the CY62167EV18LL-55BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon brings unparalleled quality and innovation to their SRAM products. Ideal for a wide range of applications, this high-performance memory chip offers customers exceptional value, efficiency, and speed. Experience seamless operation and enhanced productivity with the CY62167EV18LL-55BVXI, a versatile solution that meets the demands of today's technology-driven world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the SRAM, ensuring long-term reliability.

Nominal Supply Voltage / Vsup (V): 1.8

Efficient power consumption at a low voltage, making the SRAM suitable for a variety of devices.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, enhancing the versatility of the SRAM.

Organization: 1MX16

Offers a high memory organization, allowing for efficient data storage and retrieval.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, making it an energy-efficient choice.

Technical Specifications

SRAM CY62167EV18LL-55BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

1 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

2.25 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY62167EV18LL-55BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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