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AM5726BABCXAR

Texas Instruments

AM5726BABCXAR by Texas Instruments

The Texas Instruments AM5726BABCXAR is a microprocessor with 32-bit external data bus width, operating at a max clock frequency of 38.4 MHz. It features a package style of grid array, fine pitch and is suitable for industrial applications requiring low power mode and high-speed processing capabilities.

Median Price

$69.425

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,283 parts In-Stock

1+ parts

$69.425

100+ parts

$61.711

1k+ parts

$45.376

10k+ parts

-

1,283

$69.425

$61.711

$45.376

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$63.971

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$63.971

-

-

-

Digiode

USA . 2,167 parts In-Stock

1+ parts

$65.954

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

$65.954

-

-

-

Vyrian

USA . 3,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,433

-

-

-

-

VNN

France . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

628

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 918 parts In-Stock

1+ parts

$16.140

100+ parts

-

1k+ parts

-

10k+ parts

-

918

$16.140

-

-

-

Parana Technologies

USA . 1,427 parts In-Stock

1+ parts

$22.618

100+ parts

-

1k+ parts

$23.278

10k+ parts

-

1,427

$22.618

-

$23.278

-

IDEA Electronic Components Group

UK . 686 parts In-Stock

1+ parts

$25.414

100+ parts

$24.143

1k+ parts

$22.873

10k+ parts

-

686

$25.414

$24.143

$22.873

-

ChromeModa Solutions

Germany . 578 parts In-Stock

1+ parts

$25.414

100+ parts

$20.839

1k+ parts

-

10k+ parts

-

578

$25.414

$20.839

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$33.746

100+ parts

$30.709

1k+ parts

$27.672

10k+ parts

-

5,000

$33.746

$30.709

$27.672

-

Ampacity Inc.

Singapore . 945 parts In-Stock

1+ parts

$59.010

100+ parts

-

1k+ parts

-

10k+ parts

-

945

$59.010

-

-

-

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$60.203

100+ parts

-

1k+ parts

-

10k+ parts

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74

$60.203

-

-

-

Corphita

USA . 2,444 parts In-Stock

1+ parts

$62.482

100+ parts

-

1k+ parts

-

10k+ parts

-

2,444

$62.482

-

-

-

Bastille Electronics

Australia . 1,000 parts In-Stock

1+ parts

$63.970

100+ parts

$60.772

1k+ parts

-

10k+ parts

$56.933

1,000

$63.970

$60.772

-

$56.933

Component Stockers USA

USA . 61 parts In-Stock

1+ parts

$940.670

100+ parts

-

1k+ parts

-

10k+ parts

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61

$940.670

-

-

-

DigiPath Technology Company

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

$22.913

1k+ parts

-

10k+ parts

-

1,802

-

$22.913

-

-

Overview

Unleash the power of innovation with the AM5726BABCXAR by Texas Instruments. As a leader in microprocessor technology, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this microprocessor offers unparalleled performance and reliability. Experience seamless operation and superior efficiency with the AM5726BABCXAR, providing customers with exceptional value and cutting-edge features. Elevate your projects to new heights with Texas Instruments at the helm.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body makes the microprocessor lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto circuit boards, saving time and labor during production.

Maximum Supply Voltage: 1.2 V

With a maximum supply voltage of 1.2V, this microprocessor offers low power consumption, making it energy-efficient and cost-effective.

Address Bus Width: 16

The 16-bit address bus width enables the microprocessor to handle larger amounts of data, enhancing its performance and capabilities.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, making it suitable for compact electronic designs.

No. of Terminals: 760

The high number of terminals provides ample connectivity options for integrating the microprocessor into complex electronic systems.

Package Style: GRID ARRAY, FINE PITCH

The grid array, fine pitch package style ensures secure connections and reliable performance in demanding industrial applications.

Minimum Supply Voltage: 1.11 V

The low minimum supply voltage of 1.11V enhances the microprocessor’s energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows the microprocessor to withstand harsh industrial environments with consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold climates or refrigerated environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation and connection of the microprocessor on the circuit board, improving manufacturing efficiency.

Maximum Seated Height: 2.55 mm

The low maximum seated height of 2.55mm makes the microprocessor suitable for slim electronic devices with space constraints.

Width: 23 mm

The width of 23mm offers a compact form factor for the microprocessor, making it suitable for small electronic applications.

Boundary Scan: YES

The presence of boundary scan capability allows for efficient testing and debugging of the microprocessor during production, ensuring high quality and reliability.

External Data Bus Width: 32

The 32-bit external data bus width enables the microprocessor to process and transfer larger data sets quickly, enhancing overall performance.

Maximum Clock Frequency: 38.4 MHz

With a maximum clock frequency of 38.4MHz, this microprocessor provides fast data processing and response times for demanding applications.

Maximum Time At Peak Reflow Temperature: 30s

The short maximum time at peak reflow temperature of 30s ensures quick and efficient soldering of the microprocessor onto the circuit board during production.

Peak Reflow Temperature: 250°C

The high peak reflow temperature of 250°C allows for reliable solder connections and secure attachment of the microprocessor in industrial environments.

Length: 23 mm

The length of 23mm contributes to the compact design of the microprocessor, making it suitable for space-constrained electronic applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance of the microprocessor in extreme temperature conditions, making it ideal for industrial automation and control systems.

Peripheral IC Type: MICROPROCESSOR, RISC

The RISC architecture of this microprocessor enables fast and efficient data processing, making it suitable for high-performance computing applications.

Technology: CMOS

The CMOS technology used in this microprocessor offers low power consumption and high noise immunity, enhancing reliability and energy efficiency.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation for the microprocessor, ensuring stable performance in demanding applications.

Nominal Supply Voltage: 1.15 V

The nominal supply voltage of 1.15V strikes a balance between performance and power efficiency, making it suitable for a wide range of electronic devices.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high-density mounting of the microprocessor on the circuit board, saving space and improving overall system performance.

Format: FLOATING POINT

The floating-point format used in this microprocessor enables precise and complex mathematical calculations, making it ideal for scientific and computational applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the microprocessor is resistant to moisture-related damage, ensuring long-term reliability in humid environments.

Speed: 1500 rpm

The speed of 1500rpm indicates fast data processing and response times, making the microprocessor suitable for high-speed computing and real-time applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate efficiently at reduced power levels, extending battery life and reducing energy costs.

Technical Specifications

Microprocessors AM5726BABCXAR attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.55 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5726BABCXAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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