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AM3356BZCZ30

Texas Instruments

AM3356BZCZ30 by Texas Instruments

AM3356BZCZ30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power applications in various industries like IoT and embedded systems. With integrated cache and boundary scan feature, it offers efficient processing capabilities.

Median Price

$11.751

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,902 parts In-Stock

1+ parts

$11.751

100+ parts

$10.265

1k+ parts

$7.079

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6,902

$11.751

$10.265

$7.079

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,999 parts In-Stock

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$11.163

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3,999

$11.163

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Vyrian

USA . 6,935 parts In-Stock

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6,935

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,965 parts In-Stock

1+ parts

$2.366

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-

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1,965

$2.366

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Corphita

USA . 3,933 parts In-Stock

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$10.576

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3,933

$10.576

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AZTECH Wire

Italy . 820 parts In-Stock

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$11.860

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820

$11.860

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Corohmni

South Africa . 39 parts In-Stock

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$37.806

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39

$37.806

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Parana Technologies

USA . 1,649 parts In-Stock

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$41.155

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1,649

$41.155

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ChromeModa Solutions

Germany . 5,390 parts In-Stock

1+ parts

$46.242

100+ parts

$37.918

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5,390

$46.242

$37.918

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$46.242

100+ parts

$43.930

1k+ parts

$41.618

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1,357

$46.242

$43.930

$41.618

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$62.239

100+ parts

$56.637

1k+ parts

$51.036

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600

$62.239

$56.637

$51.036

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Lixinc

USA . 14,401 parts In-Stock

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14,401

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,288 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,192 parts In-Stock

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Component Stockers USA

USA . 3,339 parts In-Stock

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3,339

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$41.692

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1,145

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$41.692

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Native Components

USA . 886 parts In-Stock

1+ parts

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$2.086

10k+ parts

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886

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$2.086

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the AM3356BZCZ30 Microprocessor. This cutting-edge device offers integrated cache, low power mode, and a wide range of versatile applications. With a maximum clock frequency of 26 MHz and a terminal pitch of 0.8 mm, this product delivers exceptional performance and efficiency. Trust in Texas Instruments to provide you with top-notch technology that exceeds your expectations. Upgrade your systems with the AM3356BZCZ30 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides a good balance of durability and cost-effectiveness for the package housing the microprocessor.

Integrated Cache: YES

Integrated cache helps in faster data access and improves overall performance of the microprocessor.

Maximum Supply Voltage: 1.144 V

Operating within a maximum supply voltage of 1.144 V ensures efficient power consumption and reduces the risk of damage to the microprocessor.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for efficient data processing and storage within the microprocessor.

Surface Mount: YES

Being surface mountable makes it easier for the microprocessor to be integrated onto circuit boards, saving space and simplifying the assembly process.

Address Bus Width: 28

A wider address bus width of 28 bits enables the microprocessor to access a larger memory address space, allowing for more complex computations and data handling.

Package Shape: SQUARE

The square package shape offers ease of handling and placement on the circuit board, ensuring a more organized and efficient layout.

Bit Size: 32

With a bit size of 32, the microprocessor can handle 32 bits of data at a time, enhancing its processing capabilities and overall performance.

Power Supplies (V): 0.95/1.1

Supporting power supplies within the range of 0.95V to 1.1V allows for flexibility in power management and optimization based on performance requirements.

No. of Terminals: 324

Having a higher number of terminals enables more connections and functionalities to be supported, increasing the versatility and potential applications of the microprocessor.

Technical Specifications

Microprocessors AM3356BZCZ30 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT MIN 0.912 V

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3356BZCZ30 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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