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AM3354ZCZD72

Texas Instruments

AM3354ZCZD72 by Texas Instruments

AM3354ZCZD72 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 26 MHz and has low power mode, making it suitable for applications requiring high-speed processing in compact devices. With a package style of grid array, this CMOS technology-based processor is ideal for use in embedded systems where space-saving and energy efficiency are crucial.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,939 parts In-Stock

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Digiode

USA . 3,895 parts In-Stock

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LWI Electronics Inc

India . 18 parts In-Stock

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Native Components

USA . 428 parts In-Stock

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$0.333

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$0.319

428

$0.333

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$0.319

Northwest PG Solutions

USA . 816 parts In-Stock

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$0.366

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$0.323

816

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$0.323

One Stop Electronics

USA . 755 parts In-Stock

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$6.000

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755

$6.000

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AZTECH Wire

Italy . 642 parts In-Stock

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$11.857

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642

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Parana Technologies

USA . 2,014 parts In-Stock

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$60.401

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$60.401

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DigiPath Technology Company

USA . 446 parts In-Stock

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$66.509

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$61.188

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ChromeModa Solutions

Germany . 1,329 parts In-Stock

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$67.866

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$55.650

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$67.866

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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$67.866

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$64.473

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$61.079

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805

$67.866

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$61.079

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A-Z Elektronik GmbH

Germany . 5,546 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,697 parts In-Stock

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Corphita

USA . 2,963 parts In-Stock

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Perfect Parts

USA . 2,803 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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Source4Electronics, LLC

USA . 718 parts In-Stock

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Microchip USA

USA . 121 parts In-Stock

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Infinite Electronics LLP (Excess)

. 51 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the AM3354ZCZD72 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge microprocessor offers seamless integration, high-speed processing, and low power consumption, making it ideal for a wide range of applications. From IoT devices to industrial automation, this product delivers exceptional value, benefits, and advantages to customers seeking top-notch quality and efficiency. Upgrade your technology with Texas Instruments and take your projects to the next level with the AM3354ZCZD72.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the microprocessor, ensuring a longer lifespan for the product.

Integrated Cache: YES

The integrated cache helps improve the performance and efficiency of the microprocessor by reducing data access times.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Minimum Supply Voltage: 1.21 V

Having a low minimum supply voltage means that the microprocessor can operate efficiently while consuming less power.

Maximum Clock Frequency: 26 MHz

With a maximum clock frequency of 26 MHz, this microprocessor is capable of handling tasks quickly and efficiently.

Technical Specifications

Microprocessors AM3354ZCZD72 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1,0.95/1.26

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Speed:

720 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354ZCZD72 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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