Loading...

AM3354BZCEA60

Texas Instruments

AM3354BZCEA60 by Texas Instruments

AM3354BZCEA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 105°C and boundary scan capability.

Median Price

$10.342

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,311 parts In-Stock

1+ parts

$10.342

100+ parts

$9.034

1k+ parts

$6.230

10k+ parts

-

1,311

$10.342

$9.034

$6.230

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,879 parts In-Stock

1+ parts

$9.825

100+ parts

-

1k+ parts

-

10k+ parts

-

2,879

$9.825

-

-

-

Vyrian

USA . 9,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,033

-

-

-

-

TME

Poland . 6,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.570

10k+ parts

-

6,720

-

-

$10.570

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 938 parts In-Stock

1+ parts

$8.790

100+ parts

-

1k+ parts

-

10k+ parts

-

938

$8.790

-

-

-

Corphita

USA . 2,629 parts In-Stock

1+ parts

$9.308

100+ parts

-

1k+ parts

-

10k+ parts

-

2,629

$9.308

-

-

-

AZTECH Wire

Italy . 302 parts In-Stock

1+ parts

$18.750

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$18.750

-

-

-

Parana Technologies

USA . 1,727 parts In-Stock

1+ parts

$48.018

100+ parts

-

1k+ parts

-

10k+ parts

-

1,727

$48.018

-

-

-

ChromeModa Solutions

Germany . 5,749 parts In-Stock

1+ parts

$53.953

100+ parts

$44.241

1k+ parts

-

10k+ parts

-

5,749

$53.953

$44.241

-

-

IDEA Electronic Components Group

UK . 240 parts In-Stock

1+ parts

$53.953

100+ parts

$51.255

1k+ parts

$48.558

10k+ parts

-

240

$53.953

$51.255

$48.558

-

Northwest PG Solutions

USA . 1,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.707

10k+ parts

-

1,238

-

-

$4.707

-

DigiPath Technology Company

USA . 1,031 parts In-Stock

1+ parts

-

100+ parts

$48.644

1k+ parts

-

10k+ parts

-

1,031

-

$48.644

-

-

Component Stockers USA

USA . 532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

532

-

-

-

-

Native Components

USA . 430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.659

10k+ parts

-

430

-

-

$4.659

-

Overview

Unlock the power of cutting-edge technology with the AM3354BZCEA60 microprocessor by Texas Instruments. Designed for industrial-grade applications, this high-performance processor offers seamless integration and reliability. With a wide range of features including integrated cache, low power mode, and boundary scan capability, this product delivers exceptional value and versatility to customers in need of top-notch performance. Elevate your project with the quality and precision that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and provides good protection for the microprocessor, making it durable and long-lasting.

Integrated Cache: YES

Having an integrated cache helps improve the overall performance of the microprocessor by storing frequently used data for quick access.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage of 1.144 V ensures stable operation of the microprocessor without risking damage due to overvoltage.

Bit Size: 32

With a 32-bit size, this microprocessor is capable of processing data in larger chunks, leading to faster and more efficient performance.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows for reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making this microprocessor energy-efficient and fast.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency of 26 MHz ensures fast data processing and smooth operation of the microprocessor.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC microprocessor, this device is optimized for reduced instruction set computing, resulting in faster execution of instructions.

Technical Specifications

Microprocessors AM3354BZCEA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

298

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.3 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCEA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20