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AM3352ZZCZA60

Texas Instruments

AM3352ZZCZA60 by Texas Instruments

AM3352ZZCZA60 by Texas Instruments is a 32-bit microprocessor with 16-bit address and data bus width, operating at max 26 MHz. It features integrated cache, low power mode, and boundary scan. Ideal for industrial applications requiring high-speed processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,614 parts In-Stock

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7,614

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Digiode

USA . 4,767 parts In-Stock

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4,767

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,373 parts In-Stock

1+ parts

$12.000

100+ parts

-

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1,373

$12.000

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$15.098

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564

$15.098

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Microchip USA

USA . 2,246 parts In-Stock

1+ parts

$33.310

100+ parts

$32.830

1k+ parts

$32.600

10k+ parts

$32.360

2,246

$33.310

$32.830

$32.600

$32.360

Parana Technologies

USA . 742 parts In-Stock

1+ parts

$56.112

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742

$56.112

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DigiPath Technology Company

USA . 1,262 parts In-Stock

1+ parts

$61.786

100+ parts

$56.843

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-

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1,262

$61.786

$56.843

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ChromeModa Solutions

Germany . 3,337 parts In-Stock

1+ parts

$63.047

100+ parts

$51.699

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3,337

$63.047

$51.699

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IDEA Electronic Components Group

UK . 2,246 parts In-Stock

1+ parts

$63.047

100+ parts

$59.895

1k+ parts

$56.742

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2,246

$63.047

$59.895

$56.742

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Corphita

USA . 3,566 parts In-Stock

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3,566

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Native Components

USA . 908 parts In-Stock

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$4.593

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908

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$4.593

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Northwest PG Solutions

USA . 392 parts In-Stock

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$4.640

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392

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$4.640

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Overview

Unlock the power of cutting-edge technology with the AM3352ZZCZA60 microprocessor by Texas Instruments. Crafted with precision and expertise, this high-quality component offers unmatched performance and reliability for a wide range of applications. Whether you're designing industrial automation systems or consumer electronics, this microprocessor provides the speed, efficiency, and low power mode you need to stay ahead of the competition. Trust in Texas Instruments to deliver superior products that exceed your expectations and elevate your projects to the next level.

Feature Benefit Bullets

Integrated Cache: YES

Having an integrated cache helps improve the overall performance of the microprocessor by reducing the average time to access memory.

Address Bus Width: 16

With a wider address bus width, this microprocessor can handle larger memory addresses and data transfers, making it suitable for tasks that require high memory capacity.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows this microprocessor to be used in industrial environments where temperature fluctuations are common without risking damage to the component.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microprocessor energy efficient and reliable for long-term use.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency allows this microprocessor to handle complex tasks and processes at a faster rate, making it suitable for applications that require high-speed processing.

Technical Specifications

Microprocessors AM3352ZZCZA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

324

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3352ZZCZA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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