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AM3352ZCE50

Texas Instruments

AM3352ZCE50 by Texas Instruments

AM3352ZCE50 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit address and external data bus width. It operates at a max clock frequency of 26 MHz and is suitable for low power applications in various industries. The package style is grid array with 298 terminals, making it ideal for compact designs requiring high processing speeds.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,438 parts In-Stock

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Digiode

USA . 1,118 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 683 parts In-Stock

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$7.565

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683

$7.565

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Parana Technologies

USA . 13 parts In-Stock

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$14.985

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$1,391.578

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$13.486

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13

$14.985

$1,391.578

$13.486

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DigiPath Technology Company

USA . 961 parts In-Stock

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$16.500

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$15.180

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961

$16.500

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ChromeModa Solutions

Germany . 3,462 parts In-Stock

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$16.837

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$13.806

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IDEA Electronic Components Group

UK . 1,826 parts In-Stock

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$16.837

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$15.995

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$15.153

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$16.837

$15.995

$15.153

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Ampacity Inc.

Singapore . 1,239 parts In-Stock

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$26.000

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One Stop Electronics

USA . 1,561 parts In-Stock

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$32.000

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QUARKTWIN TECHNOLOGY LTD

USA . 23,053 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,485 parts In-Stock

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Corphita

USA . 4,971 parts In-Stock

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Microchip USA

USA . 4,925 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,323 parts In-Stock

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Metaverse IC Inc.

Canada . 3,750 parts In-Stock

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Northwest PG Solutions

USA . 1,084 parts In-Stock

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Perfect Parts

USA . 610 parts In-Stock

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610

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Native Components

USA . 566 parts In-Stock

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566

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Overview

Experience unmatched performance and reliability with the Texas Instruments AM3352ZCE50 Microprocessor. With a reputation for excellence, Texas Instruments delivers cutting-edge technology in the form of this high-quality microprocessor. Ideal for a wide range of applications, this product offers seamless integration, enhanced efficiency, and superior performance. Trust in Texas Instruments to provide you with top-of-the-line solutions that exceed expectations. Elevate your projects with the AM3352ZCE50 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microprocessor, ensuring longevity and reliability.

Integrated Cache: YES

Having an integrated cache improves the performance and speed of the microprocessor by reducing memory access times.

Maximum Supply Voltage: 1.15 V

Operating within a safe voltage range can prolong the lifespan of the microprocessor and prevent damage from electrical surges.

Address Bus Width: 16

A wider address bus allows for larger memory addressing capabilities, enabling the microprocessor to handle more data efficiently.

Bit Size: 32

A 32-bit architecture supports larger data processing and computational capabilities, making the microprocessor suitable for high-performance tasks.

Power Supplies (V): 0.95/1.1

With multiple power supply options, the microprocessor can be optimized for different performance levels or energy efficiency requirements.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style allows for compact and efficient integration of the microprocessor into various electronic devices, saving space and enabling sleek designs.

Maximum Clock Frequency: 26 MHz

Operating at a high clock frequency enables fast data processing, making the microprocessor suitable for demanding applications that require quick response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable for long-term use.

Low Power Mode: YES

The availability of a low power mode allows the microprocessor to conserve energy when idle or performing less demanding tasks, extending battery life in mobile devices.

Technical Specifications

Microprocessors AM3352ZCE50 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

298

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

500 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.15 V

Minimum Supply Voltage:

1.06 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352ZCE50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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