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74CBT16214DGGRG4

Texas Instruments

74CBT16214DGGRG4 by Texas Instruments

74CBT16214DGGRG4 by Texas Instruments is a 12-function multiplexer with 0.25 ns propagation delay at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has a max supply voltage of 5.5V. Ideal for high-speed data switching applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,655 parts In-Stock

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Digiode

USA . 4,651 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 119 parts In-Stock

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Native Components

USA . 206 parts In-Stock

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$0.150

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$0.144

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Northwest PG Solutions

USA . 1,684 parts In-Stock

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$0.165

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One Stop Electronics

USA . 434 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 869 parts In-Stock

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$13.600

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$13.600

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Parana Technologies

USA . 39 parts In-Stock

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$27.500

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$36.621

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$36.621

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DigiPath Technology Company

USA . 183 parts In-Stock

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$30.281

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$27.859

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ChromeModa Solutions

Germany . 6,963 parts In-Stock

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$30.899

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$25.337

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$30.899

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IDEA Electronic Components Group

UK . 2,059 parts In-Stock

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$29.354

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$27.809

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Microchip USA

USA . 2,541 parts In-Stock

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Corphita

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Overview

Experience seamless and reliable data transmission with the 74CBT16214DGGRG4 by Texas Instruments. Crafted with precision and expertise, this multiplexer & demultiplexer offers unparalleled performance and efficiency. Whether you're in the industrial sector or working on electronic projects, this product guarantees top-notch quality and functionality. With a compact design and advanced technology, it delivers fast propagation delay and true output polarity, ensuring optimal results every time. Trust Texas Instruments for superior products that elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Propagation Delay At Nominal Supply: 0.25 ns

The low propagation delay ensures high-speed signal processing, making this product suitable for applications requiring quick response times.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying assembly.

No. of Functions: 12

With 12 functions in one device, this multiplexer/demultiplexer offers versatility and flexibility in signal routing and handling.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product is compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient signal transmission and reduces the risk of signal distortion.

Power Supplies (V): 5

The power supply requirement of 5V further enhances the compatibility of this product with various electronic devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style makes this multiplexer/demultiplexer suitable for applications where space is limited.

Output Characteristics: 3-STATE

The 3-state output feature allows the device to drive bus lines effectively, providing flexibility in signal routing.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the device can function properly even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish ensures reliable contact and corrosion resistance for long-term durability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for secure soldering during assembly processes.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that this product can withstand harsh operating conditions in industrial settings.

Technology: CMOS

The CMOS technology used in this device offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Multiplexer & Demultiplexer 74CBT16214DGGRG4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Additional Features:

BUS SWITCH

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Load Capacitance (CL):

50 pF

Moisture Sensitivity Level (MSL):

1

No. of Functions:

12

No. of Inputs:

1

No. of Outputs:

3

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.003 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

74CBT16214DGGRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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