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54F138DM

Texas Instruments

54F138DM by Texas Instruments

The Texas Instruments 54F138DM is a TTL decoder with 16 terminals, operating at temperatures from -55 to 125 °C. It has a propagation delay of 12 ns and inverted output polarity. This component is commonly used in military-grade applications requiring standard input conditioning and a nominal voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 7,650 parts In-Stock

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Digiode

USA . 2,825 parts In-Stock

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LWI Electronics Inc

India . 840 parts In-Stock

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Anansix

USA . 284 parts In-Stock

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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Resion

USA . 6 parts In-Stock

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Native Components

USA . 849 parts In-Stock

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$0.064

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$0.062

849

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$0.062

Northwest PG Solutions

USA . 1,874 parts In-Stock

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$0.071

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One Stop Electronics

USA . 1,465 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 371 parts In-Stock

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$11.337

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Parana Technologies

USA . 2,185 parts In-Stock

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$27.113

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$32.393

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DigiPath Technology Company

USA . 1,381 parts In-Stock

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$29.855

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IDEA Electronic Components Group

UK . 2,138 parts In-Stock

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$30.464

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$28.941

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$27.418

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ChromeModa Solutions

Germany . 1,215 parts In-Stock

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$30.464

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$24.980

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Corphita

USA . 853 parts In-Stock

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Supply Digital

USA . 138 parts In-Stock

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Overview

Unlock the power of efficient decoding and driving with the Texas Instruments 54F138DM. Crafted with precision and expertise, this decoder & driver promises reliability and quality like no other. From military-grade temperature tolerance to inverted output polarity, this product offers unparalleled performance in a wide range of applications. With fast propagation delays and a durable ceramic, glass-sealed body, the 54F138DM is the perfect choice for customers looking for high-value solutions that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, ensuring a longer lifespan for the product.

Propagation Delay (tpd): 12 ns

With fast propagation delay, this decoder & driver can quickly respond to input signals, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: -55 °C

The wide range of operating temperatures allows this decoder & driver to be used in both extreme cold and hot conditions.

Technology: TTL

TTL technology ensures compatibility with a wide range of systems and provides reliable performance in various applications.

Technical Specifications

Decoder & Drivers 54F138DM attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

F/FAST

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

Length:

19.94 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F138DM Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-168-6036, 5962011686036

NIIN

011686036

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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