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54F138/BEA

NXP Semiconductors

54F138/BEA by NXP Semiconductors

54F138/BEA by NXP Semiconductors is a TTL decoder with a 5V nominal voltage, featuring a fast propagation delay of 9.5 ns and operating in extreme temperatures from -55 °C to 125 °C. It’s ideal for military applications requiring reliable performance. This ceramic, glass-sealed device has 16 terminals in an in-line package.

Median Price

$2.029

Lifecycle Status

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7

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1k+

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Freelance Electronics

USA . 5 parts In-Stock

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LWI Electronics Inc

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Native Components

USA . 764 parts In-Stock

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Northwest PG Solutions

USA . 515 parts In-Stock

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One Stop Electronics

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Overview

Unlock innovative solutions with the 54F138/BEA from NXP Semiconductors, a benchmark in decoder and driver technology. Crafted with precision, this high-quality component ensures unmatched reliability across diverse applications, from military systems to industrial automation. Experience rapid performance with minimal delay, empowering your designs with efficiency and longevity. Trust NXP's legacy of excellence for superior products that enhance functionality and drive success.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed materials enhances durability and resistance to environmental factors, making this product reliable in demanding applications.

Package Shape: RECTANGULAR

The rectangular shape allows for more efficient space utilization on printed circuit boards, facilitating easier integration into various designs.

Nominal Supply Voltage / Vsup: 5V

A nominal supply voltage of 5V is standard, ensuring compatibility with a wide range of electronic systems and components.

Load Capacitance (CL): 50 pF

The specified load capacitance helps maintain signal integrity, making this decoder driver suitable for high-speed applications.

No. of Terminals: 16

With 16 terminals, this product provides flexibility for various configuration options, allowing complex designs to be easily implemented.

Package Style (Meter): IN-LINE

The in-line package style supports straight integration into circuit layouts, ensuring efficient assembly and a compact design.

Propagation Delay (tpd): 9.5 ns

A low propagation delay of 9.5 ns promotes fast signal processing, which is crucial for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

The ability to operate at a maximum temperature of 125 °C ensures reliability in high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this product can perform in extreme cold conditions, making it ideal for aerospace and military applications.

Terminal Position: DUAL

The dual terminal position configuration provides versatile mounting options, accommodating different PCB layouts and designs.

Maximum Seated Height: 5.08 mm

A maximum seated height of 5.08 mm ensures compatibility with various device enclosures, supporting compact designs without compromising performance.

Width: 7.62 mm

The 7.62 mm width is standard for through-hole components, allowing easy placement on PCBs without special modifications.

Output Polarity: INVERTED

The inverted output polarity can be advantageous in certain logic configurations, providing design flexibility in complex circuits.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V ensures the device operates effectively in low-voltage applications, expanding its usability.

Temperature Grade: MILITARY

The military temperature grade indicates this product meets stringent reliability standards, making it suitable for defense and critical applications.

Technology: TTL

Using TTL technology provides a balance of speed and power consumption, making it an efficient choice for many digital applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for robust mechanical attachment to PCBs, enhancing reliability in various environmental conditions.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is common in the industry, ensuring compatibility with a wide range of PCB designs and components.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows for a margin of safety in power supply variations, protecting the device from overvoltage conditions.

Maximum Power Supply Current (ICC): 20 mA

With a maximum power supply current of 20 mA, this product is energy efficient while still providing sufficient drive capabilities for connected loads.

Technical Specifications

Decoder & Drivers 54F138/BEA attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

3 ENABLE INPUTS

Family:

F/FAST

JESD-30 Code:

R-GDIP-T16

Load Capacitance (CL):

50 pF

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

20 mA

Propagation Delay (tpd):

9.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

54F138/BEA Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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