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74HCT4514DB,118

NXP Semiconductors

74HCT4514DB,118 by NXP Semiconductors

NXP Semiconductors' 74HCT4514DB,118 is a CMOS Decoder & Driver with 24 terminals. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 83ns. Ideal for automotive applications due to its temperature grade and latched input conditioning feature.

Median Price

$0.910

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

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$0.910

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$0.890

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$0.870

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4,000

$0.910

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Chip Stock

USA . 140,000 parts In-Stock

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Vyrian

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Digiode

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VNN

France . 1,638 parts In-Stock

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Anansix

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Nova Conductors

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Distributors (Availability)

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Ampacity Inc.

Singapore . 3,737 parts In-Stock

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$0.770

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Semicontronic

India . 3,699 parts In-Stock

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$0.751

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$0.747

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AZTECH Wire

Italy . 6,535 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,422 parts In-Stock

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Continental Prestige Electronics

USA . 6,030 parts In-Stock

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Microchip USA

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UNI Independent Distributors

Spain . 3,605 parts In-Stock

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Corphita

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Supply Digital

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Argo Parts USA

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Bastille Electronics

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Overview

Get ready to unlock a world of possibilities with the 74HCT4514DB,118 by NXP Semiconductors! This high-quality decoder and driver offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. From automotive to industrial projects, this versatile component is designed to deliver exceptional results every time. With its innovative technology and compact design, you can trust that this product will exceed your expectations. Experience the value and benefits that only NXP Semiconductors can provide, and take your projects to the next level with the 74HCT4514DB,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product long-lasting and reliable.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on a PCB, making it convenient for integration into various electronic devices.

Input Conditioning: LATCHED

Latched input conditioning ensures stable and precise signal processing, reducing the likelihood of errors and improving overall performance.

Propagation Delay (tpd): 83 ns

Low propagation delay of 83 ns ensures quick response time and efficient operation, ideal for applications requiring high-speed data processing.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance allows the product to withstand extreme temperature conditions, making it suitable for automotive applications where temperature fluctuations are common.

Technical Specifications

Decoder & Drivers 74HCT4514DB,118 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

ADDRESS LATCHES

Family:

HCT

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

83 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

74HCT4514DB,118 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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