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SN74HCT139DR

Texas Instruments

SN74HCT139DR by Texas Instruments

SN74HCT139DR by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 4 bits, and inverted output polarity. It operates at a nominal voltage of 5V with a propagation delay of 43ns, making it ideal for industrial applications requiring standard input conditioning and surface mount capabilities.

Median Price

$0.294

Lifecycle Status

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Texas Instruments

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Mouser Electronics

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Rochester

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DigiKey

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Verical

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Chip1Stop

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Digiode

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Nova Conductors

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Vyrian

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Bristol Electronics

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PC Components Company LLC

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Rebound Electronics

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ComSIT Distribution GmbH

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Resion

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Mil-Aero Solutions, Inc.

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Cyclops Electronics Ltd

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Corohmni

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Parana Technologies

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Overview

Enhance your electronics projects with the SN74HCT139DR by Texas Instruments, a top-quality decoder & driver chip designed for efficiency and reliability. With a wide range of applications, this product offers dual functions in a compact package, making it the ideal choice for your circuit design needs. Benefit from fast propagation delays, standard input conditioning, and inverted output polarity, all while enjoying the peace of mind that comes with Texas Instruments' reputation for excellence. Upgrade your projects today with the SN74HCT139DR and experience the difference in performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and resistant to damage, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 43 ns

The low propagation delay ensures fast and efficient performance, making this product suitable for applications where speed is crucial.

Surface Mount: YES

The surface mount feature allows for easy and secure mounting on circuit boards, saving space and simplifying installation.

Input Conditioning: STANDARD

The standard input conditioning ensures compatibility with a wide range of input signals, making this product versatile for various applications.

No. of Functions: 2

The two functions provide flexibility and versatility in usage, allowing for different configurations and applications.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and space-saving design, making it ideal for applications with limited space.

No. of Bits: 4

The four bits allow for more complex operations and calculations, providing higher precision and accuracy in data processing.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources and makes integration into existing systems easier.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable operation, particularly in high-frequency applications.

Power Supplies (V): 5

The 5V power supply simplifies the power management and ensures compatibility with common voltage standards.

Technical Specifications

Decoder & Drivers SN74HCT139DR attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

43 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74HCT139DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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