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SN74LVC138APW

Texas Instruments

SN74LVC138APW by Texas Instruments

SN74LVC138APW by Texas Instruments is an 8-bit decoder with a propagation delay of 6.7 ns at 3.3V, ideal for industrial applications. It operates b/w -40 to 85°C, has a load capacitance of 50 pF, and features inverted output polarity. This CMOS technology device comes in a small outline package with dual terminal position and Gull Wing form.

Median Price

$0.924

Lifecycle Status

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30

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1k+

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Texas Instruments

USA . 30,362 parts In-Stock

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$0.924

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$0.711

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DigiKey

USA . 2,121 parts In-Stock

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$1.100

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$0.638

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$0.566

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$0.515

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Mouser Electronics

USA . 377 parts In-Stock

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Arrow

USA . 270 parts In-Stock

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$0.493

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Rochester

USA . 140 parts In-Stock

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$0.635

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Freelance Electronics

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Digiode

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Nova Conductors

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QIE Inc.

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Quantum Digital Technology

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Bristol Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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TME

Poland . 261 parts In-Stock

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Flex Direct, LLC

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Semi Source

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NexGen Digital

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Lantek

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Sea View Technologies

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Atlantic Semiconductor

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Inventory MP

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A2Z Electronics, Inc.

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PC Components Company LLC

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ACDS - Activité Composants Distribution Service

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Ampacity Inc.

Singapore . 7,054 parts In-Stock

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Corphita

USA . 1,998 parts In-Stock

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Argo Parts USA

USA . 4,977 parts In-Stock

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Continental Prestige Electronics

USA . 1,822 parts In-Stock

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$0.594

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Netroflash

USA . 2,000 parts In-Stock

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Corohmni

South Africa . 25 parts In-Stock

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$0.598

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Advanced Electronics

New Zealand . 700 parts In-Stock

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Parana Technologies

USA . 360 parts In-Stock

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$34.542

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DigiPath Technology Company

USA . 1,929 parts In-Stock

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$30.082

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ChromeModa Solutions

Germany . 6,985 parts In-Stock

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$30.696

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$25.171

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IDEA Electronic Components Group

UK . 1,093 parts In-Stock

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$30.696

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$27.626

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Perfect Parts

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Lixinc

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Overview

Unlock the potential of your electronic projects with the Texas Instruments SN74LVC138APW decoder & driver. Manufactured by a trusted industry leader, this high-quality component offers fast propagation delay and versatile applications. With its inverted output polarity and low power consumption, this product is perfect for industrial-grade projects where precision and efficiency are key. Upgrade your designs with the SN74LVC138APW and experience the superior performance and reliability that Texas Instruments is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Propagation Delay At Nominal Supply: 6.7 ns

With a fast propagation delay, this decoder & driver ensures quick response times in applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving design.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to integrate into different circuit layouts.

No. of Bits: 8

With 8 bits, this decoder & drivers product provides precision in decoding and driving signals.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V ensures efficient power usage and compatibility.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF allows for stable performance in various load conditions.

Power Supplies (V): 3.3

With multiple power supplies at 3.3V, this product offers flexibility in power management.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for different applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style make this product suitable for compact designs.

Maximum I (ol): 24 Amp

With a maximum output current of 24 Amps, this product can drive high-power applications effectively.

Propagation Delay (tpd): 22 ns

The propagation delay of 22 ns ensures reliable and fast signal decoding.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C makes this product ideal for industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can also withstand harsh cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position offers flexibility in connecting to different circuits.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for compact device designs.

Width: 4.4 mm

The width of 4.4 mm makes this product suitable for applications with space constraints.

Output Polarity: INVERTED

The inverted output polarity allows for compatibility with various system configurations.

Minimum Supply Voltage (Vsup): 1.65 V

The minimum supply voltage of 1.65V ensures reliable operation even at low power.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for easy soldering during assembly.

Length: 5 mm

The length of 5 mm provides a compact form factor for easy integration into devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for rugged environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high speed.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections for reliable operation.

Packing Method: TUBE

The tube packing method ensures safe transportation and storage of the product.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm allows for precise and secure connections.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.01 mA

With a maximum power supply current of 0.01 mA, this product offers efficient power management.

Technical Specifications

Decoder & Drivers SN74LVC138APW attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVC138APW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-609-5201, 5962016095201

NIIN

016095201

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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