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SN74LVC1G19DCKRE4

Texas Instruments

SN74LVC1G19DCKRE4 by Texas Instruments

SN74LVC1G19DCKRE4 by Texas Instruments is a 3-STATE decoder with 5.2 ns propagation delay at 1.8V, ideal for industrial applications. It features a small outline package with 6 terminals and operates b/w -40 to 85°C temperature range. The device has a max supply voltage of 5.5V and low power consumption of 0.01 mA, making it suitable for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 47,920 parts In-Stock

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Digiode

USA . 4,977 parts In-Stock

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Vyrian

USA . 4,018 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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AZTECH Wire

Italy . 370 parts In-Stock

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$16.998

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370

$16.998

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Parana Technologies

USA . 2,195 parts In-Stock

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$17.993

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$18.152

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DigiPath Technology Company

USA . 200 parts In-Stock

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$19.813

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$18.228

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$19.813

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ChromeModa Solutions

Germany . 5,483 parts In-Stock

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$20.217

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$16.578

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$20.217

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IDEA Electronic Components Group

UK . 2,217 parts In-Stock

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$20.217

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$19.206

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$18.195

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One Stop Electronics

USA . 1,233 parts In-Stock

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$27.000

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Ampacity Inc.

Singapore . 395 parts In-Stock

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$55.000

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Corphita

USA . 2,802 parts In-Stock

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Microchip USA

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 64 parts In-Stock

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Overview

Unlock the power of efficient signal decoding and driving with the SN74LVC1G19DCKRE4 by Texas Instruments. Crafted from high-quality materials and backed by a reputable manufacturer, this decoder & driver offers fast propagation delay and versatile applications. Ideal for industrial settings, this product boasts a low power supply voltage and 3-state output characteristics, ensuring peak performance while consuming minimal energy. Elevate your projects with the reliability and precision of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product.

Propagation Delay At Nominal Supply: 5.2 ns

The low propagation delay ensures fast and efficient decoder and driver operations.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with various signal levels.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into different systems.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement makes this product energy efficient.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable and reliable performance.

Power Supplies (V): 3.3

The product works with a standard 3.3V power supply, making it compatible with many systems.

No. of Terminals: 6

With 6 terminals, this decoder and driver offer flexibility in connection options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and sleek package design saves space and enhances the overall aesthetics.

Maximum I (ol): 32 Amp

The high maximum output current capability of 32 Amps allows for driving multiple loads.

Propagation Delay (tpd): 16.1 ns

The propagation delay of 16.1 ns ensures fast response time for signal decoding.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output feature provides flexibility in controlling connected devices.

Minimum Operating Temperature: -40 °C

The product can operate efficiently even at extremely low temperatures of -40°C.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Ni/Pd/Au ensures reliable and durable connections.

Terminal Position: DUAL

The dual terminal position allows for easy PCB mounting and secure connections.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1 mm enables compact designs and space-saving installations.

Width: 1.25 mm

The slim width of 1.25 mm makes this product suitable for applications with limited space.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures accurate signal decoding and driving.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65 V ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes.

Length: 2 mm

The compact length of 2 mm allows for easy integration into tight spaces.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating makes this product suitable for rugged environments.

Technology: CMOS

The CMOS technology used in this product provides high-speed performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections on the PCB.

Packing Method: TR

The Tape and Reel packing method allows for easy handling and automated assembly processes.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm enables high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability of 5.5 V provides flexibility in power source options.

Maximum Power Supply Current (ICC): 0.01 mA

The low maximum power supply current requirement of 0.01 mA ensures energy efficiency and minimal power consumption.

Technical Specifications

Decoder & Drivers SN74LVC1G19DCKRE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

16.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G19DCKRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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