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74HC154DB,112

NXP Semiconductors

74HC154DB,112 by NXP Semiconductors

NXP Semiconductors' 74HC154DB,112 is a CMOS Decoder & Driver with 45 ns propagation delay at 5V. It has 24 terminals, operates b/w -40 to 125 °C, and supports a load capacitance of 50 pF. Ideal for automotive applications due to its small outline package and inverted output polarity.

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Overview

Discover the 74HC154DB,112 by NXP Semiconductors, a top-of-the-line Decoder & Drivers chip designed to exceed expectations. With a focus on quality and reliability, NXP Semiconductors delivers cutting-edge technology for a wide range of applications. From automotive to industrial uses, this product offers unmatched performance and efficiency. Experience seamless operation and improved functionality with the 74HC154DB,112, setting new standards in the industry. Elevate your projects with this innovative solution that guarantees exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures quick response time and efficient operation, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Input Conditioning: STANDARD

Standard input conditioning ensures compatibility with a wide range of input signals, making the product versatile and easy to integrate into various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common nominal supply voltage of 5V makes it compatible with many existing systems and power sources.

Maximum I (ol): 4 Amp

High maximum output current capability of 4A allows for driving larger loads without the need for external amplification, enhancing overall reliability and performance.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliable operation in harsh environments and meeting industry standards for quality and durability.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, making it suitable for various applications.

Technical Specifications

Decoder & Drivers 74HC154DB,112 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Additional Features:

2 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

74HC154DB,112 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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