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JM38510/37701B2A

Texas Instruments

JM38510/37701B2A by Texas Instruments

JM38510/37701B2A by Texas Instruments is an 8-bit decoder with 22ns propagation delay, suitable for military applications. It operates at a voltage range of 4.5V to 5.5V and has a max power supply current of 10mA. The chip carrier package style with ceramic body makes it ideal for high-temperature environments.

Median Price

$17.394

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 254 parts In-Stock

1+ parts

$17.394

100+ parts

$18.264

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$17.220

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$17.394

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$17.220

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Vyrian

USA . 7,188 parts In-Stock

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Digiode

USA . 1,568 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 54 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

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$8.486

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482

$8.486

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Parana Technologies

USA . 966 parts In-Stock

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$16.150

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$1,499.767

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$14.535

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966

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$1,499.767

$14.535

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DigiPath Technology Company

USA . 949 parts In-Stock

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$17.783

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949

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ChromeModa Solutions

Germany . 6,989 parts In-Stock

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$18.146

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$14.880

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$18.146

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

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$18.146

100+ parts

$17.239

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$16.331

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One Stop Electronics

USA . 1,001 parts In-Stock

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$57.000

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Corphita

USA . 4,943 parts In-Stock

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Microchip USA

USA . 2,862 parts In-Stock

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Overview

Elevate your projects with the JM38510/37701B2A by Texas Instruments, a top-tier manufacturer renowned for quality and reliability. This innovative decoder & driver offers unparalleled performance and versatility, making it an essential component for a wide range of applications. With fast propagation delay, standard input conditioning, and MIL-M-38510 Class B screening level, this product ensures seamless operation and precision. Experience the value of superior engineering and cutting-edge technology with the JM38510/37701B2A, providing customers with unmatched benefits and advantages that set them apart from the competition.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast response times, making it ideal for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design allows for efficient PCB layout.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with commonly used power supplies.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in various operating conditions.

Technical Specifications

Decoder & Drivers JM38510/37701B2A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT, SCHOTTKY-CLAMPED FOR HIGH PERFORMANCE

Family:

ALS

Input Conditioning:

STANDARD

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

10 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Screening Level:

MIL-M-38510 Class B

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

JM38510/37701B2A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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