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SN74LVC139ADE4

Texas Instruments

SN74LVC139ADE4 by Texas Instruments

SN74LVC139ADE4 by Texas Instruments is a 16-terminal CMOS decoder with 2 functions, featuring a propagation delay of 6.2 ns and operating temperature range from -40 to 85°C. It is commonly used in industrial applications requiring inverted output polarity and standard input conditioning, suitable for surface mount assembly with a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,498 parts In-Stock

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Digiode

USA . 180 parts In-Stock

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Nova Conductors

Japan . 35 parts In-Stock

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Parana Technologies

USA . 1,168 parts In-Stock

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$11.340

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$11.769

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ChromeModa Solutions

Germany . 3,663 parts In-Stock

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$12.742

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$10.448

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IDEA Electronic Components Group

UK . 545 parts In-Stock

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$11.468

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AZTECH Wire

Italy . 640 parts In-Stock

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Corohmni

South Africa . 1,174 parts In-Stock

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Ampacity Inc.

Singapore . 1,581 parts In-Stock

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One Stop Electronics

USA . 1,237 parts In-Stock

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$37.000

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Semicontronic

India . 1,500 parts In-Stock

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Continental Prestige Electronics

USA . 3,679 parts In-Stock

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Perfect Parts

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Argo Parts USA

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Corphita

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DigiPath Technology Company

USA . 436 parts In-Stock

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Aranea Global

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Overview

Discover the exceptional quality and reliability of the SN74LVC139ADE4 by Texas Instruments, a leading manufacturer in the industry. This versatile decoder & driver is designed to meet a wide range of application needs with precision and efficiency. Offering fast propagation delay, low power consumption, and inverted output polarity, this product provides unparalleled value and benefits to customers. Whether you're working on a complex electronic project or looking for a reliable component for industrial applications, the SN74LVC139ADE4 delivers superior performance that exceeds expectations. Unlock the potential of your designs with this exceptional product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast and efficient operation of the decoder, improving overall performance.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and improving assembly efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low nominal supply voltage, making it energy efficient and suitable for low power applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the decoder can withstand harsh environmental conditions and maintain reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder reliable and energy efficient.

Technical Specifications

Decoder & Drivers SN74LVC139ADE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

20.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74LVC139ADE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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